On-chip versus off-chip passives in multi-band radio design

An on-chip balun is useful in millimeter-wave integrated circuits. However, conventional baluns are unsuitable for the on-chip application because the terminal impedance is generally standardized by 50Q, which is not necessarily applies on a chip. Thus, we propose a novel on-chip rat-race balun with stubs for matching arbitrary terminal impedances. The on-chip balun with stubs is designed by applying the optimization method of two-port filters, and the characteristic of the balun is verified by a three-dimensional electromagnetic simulation.

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On-Chip Rat-Race Balun with Stubs for Matching Arbitrary Terminal Impedances

Goto

Kobayashi

Fujishima

2007

2007 Asia-Pacific Microwave Conference

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Embedded smart systems for intelligent paper and packaging

Zheng

Shen

Duo

et al.

Proceedings Electronic Components and Technology, 2005. ECTC '05.

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In this paper, we present architecture, circuit implementation and integration issues of an embedded smart system for innovative, long-range interconnected identification/sensor network in warehouse and intelligent goods distribution systems. The network is interconnected via IEEE 802.11 and ultra-wideband (UWB) wireless air interfaces. A self-powered, ultra-low power UWB transceiver with BPSK modulation is designed for transponders and implemented in 0.18um CMOS technology. Low power consumption is achieved by developing innovative circuit and system architectures. Instead of pumping up energy from the Gaussian pluses emitted by the reader, a power converter draws energy from the 802.11 access point and its surrounding electromagnetic waves. Functionality of the transceiver is verified and integration issues for smart labels are investigated on thin foils of liquid crystal polymer.

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Analysis of lossy packaging parasitics for common emitter LNA in system-on-package

Duo

Zheng

Ismail

et al.

Electrical Performance of Electronic Packaging

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On-chip versus off-chip passives in multi-band radio design

Cited by 12 publications

References 5 publications

On-Chip Rat-Race Balun with Stubs for Matching Arbitrary Terminal Impedances

On-Chip Rat-Race Balun with Stubs for Matching Arbitrary Terminal Impedances

Embedded smart systems for intelligent paper and packaging

Analysis of lossy packaging parasitics for common emitter LNA in system-on-package

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