On corrosion-induced stress states in binary noble metal alloys

Mon, K.; Ferrari, Mauro

doi:10.1016/s0921-5093(97)00098-1

Cited by 11 publications

(6 citation statements)

References 16 publications

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“…The maximum S 11 appeared at the interface. An eigenstrain analysis 3 and molecular dynamics simulation 2 on the stress distribution in the de-alloyed layer and substrate region revealed that the maximum tensile stress existed at the interface, which is consistent with our FEM results.…”

Section: Resultssupporting

confidence: 88%

“…Consequently, a stress (referred to as the CPF-induced stress) will be induced in the metallic substrate to balance the residual stresses in the CPFs 1 . Experimental and theoretical studies have demonstrated that the CPF-induced stress is usually tensile and the maximum tensile stress exists at the interface between the CPF and the metallic substrate 1 2 3 on the matrix side. Systematic studies 4 5 6 7 8 9 10 11 12 13 14 15 16 have revealed that the dependence of the CPF-induced stress on the anion concentration 4 , the pH value 5 of the solution, and the applied potential 6 and hydrogen concentration in the specimens 7 corresponds with the SCC susceptibility results from slow strain rate tests.…”

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confidence: 99%

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Corrosion Product Film-Induced Stress Facilitates Stress Corrosion Cracking

Wang

Zhang

Ren

et al. 2015

Sci Rep

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Finite element analyses were conducted to clarify the role of corrosion product films (CPFs) in stress corrosion cracking (SCC). Flat and U-shaped edge-notched specimens were investigated in terms of the CPF-induced stress in the metallic substrate and the stress in the CPF. For a U-shaped edge-notched specimen, the stress field in front of the notch tip is affected by the Young’s modulus of the CPF and the CPF thickness and notch geometry. The CPF-induced tensile stress in the metallic substrate is superimposed on the applied load to increase the crack tip strain and facilitate localized plasticity deformation. In addition, the stress in the CPF surface contributes to the rupture of the CPFs. The results provide physical insights into the role of CPFs in SCC.

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Section: Resultssupporting

confidence: 88%

mentioning

confidence: 99%

Corrosion Product Film-Induced Stress Facilitates Stress Corrosion Cracking

Wang

Zhang

Ren

et al. 2015

Sci Rep

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“…It can be concluded that for a U-shaped single-edge-notched specimen, with an increase in CPF Young's modulus, the peak S 11 decreases and the absolute value of the stress in the CPF increases. Eigen-strain analysis [22] and molecular dynamics simulation [23] in a flat specimen on the stress distribution in de-alloyed layer and substrate region show that there is a tensile stress in the substrate, which is in good accordance with the FEM results. But differently, the maximum tensile stress exists at the interface in the flat specimen, while in U-shaped single-edgenotched specimen, it appears near the interface.…”

Section: Resultssupporting

confidence: 78%

Finite element analysis of stress corrosion cracking for copper in an ammoniacal solution

et al. 2015

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Finite element analyses including a cohesive zone model (CZM) were conducted to investigate the role of corrosion product films (CPFs) in stress corrosion cracking (SCC) for copper in an ammoniacal solution. It is found that a tensile CPF-induced stress generates near the interface between the CPF and the copper substrate at the substrate side in front of the notch tip for a U-shaped edgenotched specimens. The CPF-induced stress is superimposed on the applied stress to enhance emission and motion of dislocations. The peak opening stress (S 11 ) increases with an increase in CPF thickness and a decrease in CPF Young's modulus. Damage mechanics based on the CZM was applied to study the stress corrosion crack initiation and propagation by analyzing the stress redistributions and load-displacement curves. The results show that the crack initiates first in the CPF and then propagates to the copper substrate. The fracture strain of the specimen covered a CPF is lower than that without a CPF. Based on the simulation results, the mechanism of the CPF-induced SCC, which promoted the initiation and propagation of the stress corrosion cracks, was discussed.

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“…In the dealloying process, the compressive stress is triggered in the dealloyed layer, which hinders the diffusion and rearrangement of inner Au atoms of the samples. , The greater the initial compressive pressure in ribbons, correspondingly, the harder the reorganization of Au atoms and the smaller the ligament spacing. Indeed, the reorganization of atoms at lower temperature during dealloying AuCu film is more difficult than that at high temperature, resulting in a nanoporous Au with finer ligament and pore at low dealloying temperature .…”

Section: Results and Discussionmentioning

confidence: 99%

High Activity Methanol/H₂O₂ Catalyst of Nanoporous Gold from Al–Au Ribbon Precursors with Various Circumferential Speeds

Shen

Liu

et al. 2016

J. Phys. Chem. C

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We have prepared nanoporous gold (np-Au) with a three-dimensional (3D) bicontinuous interpenetrating ligament-channel structure by dealloying the melt spun Al 2 Au ribbon precursors with three different circumferential speeds (S c ). With increasing S c , the lattice constant (a 0 ) of precursors decreases. After the dealloying procedure, the np-Au samples have an increasing a 0 and a decreasing pore size with increasing S c . There exists the heredity of the preferred orientation factors (F) between precursors and np-Au samples. The cyclic voltammetry (CV) curves of methanol electro-oxidation reaction (MOR) on np-Au samples are related to their F and show a higher activity with a higher S c . In addition, np-Au with a lower pore size exhibits a higher sensitivity for the concentration of H 2 O 2 in phosphate buffered solutions (PBS), which reaches 73.4 μA mM −1 cm −2 with S c = 18.3 m/s. These results suggest that we can change the pore size of the dealloyed np-Au by adjusting the S c of the precursors, and then enhance the catalytic activity of np-Au.

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On corrosion-induced stress states in binary noble metal alloys

Cited by 11 publications

References 16 publications

Corrosion Product Film-Induced Stress Facilitates Stress Corrosion Cracking

Corrosion Product Film-Induced Stress Facilitates Stress Corrosion Cracking

Finite element analysis of stress corrosion cracking for copper in an ammoniacal solution

High Activity Methanol/H₂O₂ Catalyst of Nanoporous Gold from Al–Au Ribbon Precursors with Various Circumferential Speeds

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On corrosion-induced stress states in binary noble metal alloys

Cited by 11 publications

References 16 publications

Corrosion Product Film-Induced Stress Facilitates Stress Corrosion Cracking

Corrosion Product Film-Induced Stress Facilitates Stress Corrosion Cracking

Finite element analysis of stress corrosion cracking for copper in an ammoniacal solution

High Activity Methanol/H2O2 Catalyst of Nanoporous Gold from Al–Au Ribbon Precursors with Various Circumferential Speeds

Contact Info

Product

Resources

About

High Activity Methanol/H₂O₂ Catalyst of Nanoporous Gold from Al–Au Ribbon Precursors with Various Circumferential Speeds