On Droplet Microfluidics and Security Feature Microfabrication with Scalable Electrohydrodynamic Nanoprinting

Chaaban, Jana

doi:10.3929/ethz-b-000502765

Cited by 1 publication

(1 citation statement)

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“…While currently not implemented on our system, extractor electrodes (a counter electrode mounted in close proximity to the nozzle) can forgo the need for a conductive electrode below the substrate and have successfully been demonstrated for highresolution EHD printing. [31] The setup established in this work also allows for deposition on conducting substrates. In this case, the electron beam can be used as a mere operando imaging tool (Figure 3, Figure S4b, Supporting Information).…”

Section: Direct Electron-beam Enabled Deposition On Insulatorsmentioning

confidence: 99%

Direct In‐ and Out‐of‐Plane Writing of Metals on Insulators by Electron‐Beam‐Enabled, Confined Electrodeposition with Submicrometer Feature Size

Nydegger,

Wang,

Willinger

et al. 2024

Small Methods

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Additive microfabrication processes based on localized electroplating enable the one‐step deposition of micro‐scale metal structures with outstanding performance, e.g., high electrical conductivity and mechanical strength. They are therefore evaluated as an exciting and enabling addition to the existing repertoire of microfabrication technologies. Yet, electrochemical processes are generally restricted to conductive or semiconductive substrates, precluding their application in the manufacturing of functional electric devices where direct deposition onto insulators is often required. Here, the direct, localized electrodeposition of copper on a variety of insulating substrates, namely Al2O3, glass and flexible polyethylene, is demonstrated, enabled by electron‐beam‐induced reduction in a highly confined liquid electrolyte reservoir. The nanometer‐size of the electrolyte reservoir, fed by electrohydrodynamic ejection, enables a minimal feature size on the order of 200 nm. The fact that the transient reservoir is established and stabilized by electrohydrodynamic ejection rather than specialized liquid cells can offer greater flexibility toward deposition on arbitrary substrate geometries and materials. Installed in a low‐vacuum scanning electron microscope, the setup further allows for operando, nanoscale observation and analysis of the manufacturing process.

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Section: Direct Electron-beam Enabled Deposition On Insulatorsmentioning

confidence: 99%