On the Analysis of Physical Properties of Thermointerfaces Based on Hexagonal Boron Nitride Nanostructures for Cooling the Electronic Component Base of Micro- and Nanoelectronics

Abstract

An empirical study of the physical properties (thermal conductivity, thermal diffusivity, and density) of thermophysical interfaces based on a hexagonal boron nitride (h-BN) nanopowder lattice for cooling electronic component bases in micro- and nano-electronics has been conducted. The physical properties were determined using the laser flash method and the relative method. The potential of compressed nanoparticles of hexagonal boron nitride as a thermophysical interface without an adhesive agent has been described. This article also provides a comparison of the physical properties of other thermophysical interfaces that are widely used today.