“…Examples are debonding and delamination [6,7]-e.g., of thin films [8,9], peeling of adhesive strips [10], rubber adhesion [11], adhesion by capillary bridges [12], flow and aggregation of adhesive particles [13,14,15], rough surface adhesion [16] and bonding [17], multiscale adhesion modeling [18,19,20], adhesive bonding technology [21,22], MEMS and NEMS (microand nano-electromechanical systems) [23,24], insect and lizard adhesion [25,26], climbing robots [27], microfiber arrays [28,29,30,31,32,33], biomimetic and patterned adhesive surfaces [34,35], self-cleaning mechanisms [36], biofouling [37], membrane adhesion [38,39,40,41], adhesion of cells [42], and hemostatic platelet adhesion [43]. In order to structure this survey we distinguish between the following three modeling approaches for adhesion: a) local material models that describe the material behavior within the adhesive (Sec.2), b) local interface models that describe the bonding behavior at the material interface (Sec.…”