2023
DOI: 10.6060/ivkkt.20236606.6786
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ON THE COMPARISON OF REACTIVE-ION ETCHING MECHANISMS FOR SiO2 AND Si3N4 IN HBr + Ar PLASMA

Abstract: This work investigated the influence of component ratio in the HBr + Ar gas mixture on electro-physical plasma parameters, steady-state densities of active species and reactive-ion etching (RIE) kinetics for SiO2 and Si3N4 under conditions of inductive RF (13.56 MHz) discharge. The combination of plasma diagnostics by Langmuir probes and plasma modeling indicated that an increase in Ar content at constant gas pressure and input power a) caused an increase in electron temperature and densities of charged specie… Show more

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