On the development of national standards for magnetic and eddy-current nondestructive inspection of steel pipes

Shcherbinin, V. E.; Blinov, Yu.; Shleenkov, A. S.; Barmenkov, B. G.; Костин, В. Н.

doi:10.1134/s1061830909100106

Cited by 4 publications

(2 citation statements)

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“…Thus, the development of physical fundamentals of up to date manufacturing processes and technical diagnostics is of crucial significance [1][2][3].…”

Section: Introductionmentioning

confidence: 99%

The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices

Shtennikov

Budai

2013

Russ J Nondestruct Test

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Abstract-Automated control systems employ electronic components that are connected with a printed circuit board (PCB) by soldered joints. At elevated temperatures and with high vibration levels, soldering defects may occur that are characterized by the deterioration or complete loss of contact with the PCB, which can lead to the failure of the system. In this work, an approach is proposed to consid erably improve the reliability of soldered joints.

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“…Thus, the development of physical fundamentals of up to date manufacturing processes and technical diagnostics is of crucial significance [1][2][3].…”

Section: Introductionmentioning

confidence: 99%

The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices

Shtennikov

Budai

2013

Russ J Nondestruct Test

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“…Frequent failures of automation systems lead to a significant decrease in the working efficiency. Therefore, along with the further development of the trends that provide direct testing of the initial materials, parts, and articles [4][5][6], methods for increasing the failure free operation of instruments via the provision of optimal conditions of technological processes and use of appropriate operating tools are becoming more and more urgent [7,8].…”

Section: Introductionmentioning

confidence: 99%

The reliability of soldered joints produced at a low temperature

Shtennikov

Budai

2013

Russ J Nondestruct Test

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Abstract-Under severe service conditions of electronic instruments (at elevated temperatures and vibrations in electronic systems), failures in their operation frequently occur. Severe intrinsic thermal conditions of operating instruments may cause such failures. However, malfunctions in electronic devices may often be due to defects in soldered joints that were made at lowered temperatures. An approach is proposed that makes it possible to considerably improve the reliability of soldered joints.

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Flexible in-line measurement technology for surface defects of small bores

Zhang

Xue

2015

Optics & Laser Technology

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On the development of national standards for magnetic and eddy-current nondestructive inspection of steel pipes

Cited by 4 publications

References 0 publications

The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices

The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices

The reliability of soldered joints produced at a low temperature

Flexible in-line measurement technology for surface defects of small bores

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