Comprehensive and systematic electrical studies were performed on fabrication of high quality SiO 2 thin films MOS capacitor using the robust, novel, and simple atomic layer deposition (ALD) technique using highly reactive ozone and tris (dimethylamino) silane (TDMAS) precursors. Ideal capacitance-voltage curve exhibits a very small frequency dispersion and hysteresis behavior of the SiO 2 MOS capacitor grown at 1 s TDMAS pulse, suggesting excellent interfacial quality and purity of the film as probed using x-ray photoelectron studies. The flat-band voltage of the device shifted from negative toward positive voltage axis with increase of TDMAS pulses from 0.2 to 2 s. Based on an equivalent oxide thickness point of view, all SiO 2 films have gate leakage current density of (5.18 Â 10 À8 A/cm 2 ) as well as high dielectric break down fields of more than ($10 MV/cm), which is better and comparable to that of thermally grown SiO 2 at temperatures above 800 C. These appealing electrical properties of ALD grown SiO 2 thin films enable its potential applications such as high-quality gate insulators for thin film MOS transistors, as well as insulators for sensor and nanostructures on nonsilicon substrates.