On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications

Yan, Jiwang; Yoshino, Masahiko; Kuriagawa, T.; Shirakashi, Takahiro; Syoji, Katsuo; Komanduri, R.

doi:10.1016/s0921-5093(00)01031-5

Cited by 159 publications

(69 citation statements)

References 13 publications

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“…It was found surface roughness obtained in DMC of silicon was much better than that generated from the grinding [55]. Very smooth surfaces and continuous chips can be achieved in DMC of silicon using an external high hydrostatic pressure of 400 MPa with a diamond tool having an edge radius at nanometer scale [21]. A surface roughness value of below 10 nm was obtained in DMC of silicon wafers as shown in Fig.…”

Section: Surface Finishmentioning

confidence: 86%

“…A customized stage having an external hydrostatic pressure attachment was used to cut silicon at the nanometric scale with diamond tools [21]. Very smooth surfaces and continuous chips, i.e., DMC, were achieved with an UCT of 50 nm, which is larger than the critical UCT of 40 nm [45] (both studies of Refs.…”

Section: Discussionmentioning

confidence: 99%

“…Very smooth surfaces and continuous chips, i.e., DMC, were achieved with an UCT of 50 nm, which is larger than the critical UCT of 40 nm [45] (both studies of Refs. [21,45] using the off-the-shelf single crystal diamond tools supposed having the same range cutting edge radius, other diamond tools with lager tool edge radii used in Ref. [45] were unusual and particularly polished in the lab, and their edge radii were measured using an indentation method [93]).…”

Section: Discussionmentioning

confidence: 99%

“…Indentation on the soda-lime glass at different loads using a Vicker's pyramid indenter indicated that above a certain critical loading cracking was favourable while below the critical loading plastic flow was possible [20]. Indentation method was also used to evaluate the plastic deformation of brittle materials at high hydrostatic pressure [21][22][23][24]. A schematic illustration is shown in Fig.…”

Section: Ductile Nature and Plasticity Of Brittle Materialsmentioning

confidence: 99%

“…A schematic illustration is shown in Fig. 2 for the elastic-plastic behaviour of brittle materials under indentation [21]. Indentation testing at light loadings shows that in the region immediately below the indenter, the material expands and exerts pressure to the surroundings.…”

Section: Ductile Nature and Plasticity Of Brittle Materialsmentioning

confidence: 99%

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A review on ductile mode cutting of brittle materials

2018

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Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.

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Section: Surface Finishmentioning

confidence: 86%

Section: Discussionmentioning

confidence: 99%