2013
DOI: 10.3103/s1068375513030046
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On the effect of the parameters of an induction-capacitance device upon the process of electroplates deposition

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Cited by 3 publications
(2 citation statements)
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“…The ICD parameters affect as well the structure of copper and nickel coatings deposited using various power sources [11,12,[14][15][16][17][18].…”
Section: Fig6 Morphology Of Copper Deposited From Sulphate Electrolymentioning
confidence: 99%
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“…The ICD parameters affect as well the structure of copper and nickel coatings deposited using various power sources [11,12,[14][15][16][17][18].…”
Section: Fig6 Morphology Of Copper Deposited From Sulphate Electrolymentioning
confidence: 99%
“…The necessary capacity was ensured by a parallel connection of electrolytic condensers, and mainly in the experiments the condenser capacity was C = 2200 mkF. For the deposition of the coating we used, as a rule, a single-phase, three-phase, six-phase and 60W switching power sources, as well as a lead accumulator [10][11][12][13][14][15].…”
Section: Introductionmentioning
confidence: 99%