On the Electric Conductivity of Cuprous Sulfide : Experiment

Miyatani, Shin-ya; Suzuki, Yasuyuki

doi:10.1143/jpsj.8.680

Cited by 39 publications

(25 citation statements)

References 2 publications

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“…This phenomenon was clearly reported in Cu 2 S by Miyatani et al [101] in 1953 for the first time, and was also found within Cu 2 Se by Ema [102] in 1990.…”

Section: Concerns About Cu Migration and Materials Stabilitysupporting

confidence: 70%

Copper chalcogenide thermoelectric materials

et al. 2018

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Cu-based chalcogenides have received increasing attention as promising thermoelectric materials due to their high efficiency, tunable transport properties, high elemental abundance and low toxicity. In this review, we summarize the recent research progress on this large family compounds covering diamond-like chalcogenides and liquid-like Cu 2 X (X=S, Se, Te) binary compounds as well as their multinary derivatives. These materials have the general features of two sublattices to decouple electron and phonon transport properties. On the one hand, the complex crystal structure and the disordered or even liquid-like sublattice bring about an intrinsically low lattice thermal conductivity. On the other hand, the rigid sublattice constitutes the charge-transport network, maintaining a decent electrical performance. For specific material systems, we demonstrate their unique structural features and outline the structure-performance correlation. Various design strategies including doping, alloying, band engineering and nanostructure architecture, covering nearly all the material scale, are also presented. Finally, the potential of the application of Cu-based chalcogenides as high-performance thermoelectric materials is briefly discussed from material design to device development.

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“…This phenomenon was clearly reported in Cu 2 S by Miyatani et al [101] in 1953 for the first time, and was also found within Cu 2 Se by Ema [102] in 1990.…”

Section: Concerns About Cu Migration and Materials Stabilitysupporting

confidence: 70%

Copper chalcogenide thermoelectric materials

et al. 2018

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“…Despite the high TE performance, the liquid‐like TE materials suffer from major ion migration and the resulting metal deposition when they are exposed to an external electric field or thermal gradient. For example, Miyatani et al observed notable Cu deposition at the cathode of Cu 2 S when subjected to a strong electronic current . Dennler et al found many copper whiskers and cracks on the sample surface of Cu 2 S after 24 h current stress with a current density of 24 A cm −2 .…”

Section: Stability Issue Of Liquid‐like Te Materials Under Directionamentioning

confidence: 99%

Recent Advances in Liquid‐Like Thermoelectric Materials

Zhao

Qiu

Shi

et al. 2019

Adv Funct Materials

195

124

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Thermoelectric technology has attracted great attention due to its ability to recover and convert waste heat into readily available electric energy. Among the various candidate materials, liquid‐like compounds have received tremendous research interest on account of their intrinsically ultralow lattice thermal conductivity, tunable electrical properties, and high thermoelectric performance. Despite their complex phase transitions and diverse crystal structures, liquid‐like materials have two independent sublattices in common: one rigid sublattice formed by immobile ions for the free transport of electrons and one liquid‐like sublattice consisting of highly mobile ions to interrupt the thermal transports. This review first outlines the common structural features of liquid‐like thermoelectrics, along with their unusual electron and phonon transport behaviors that well satisfy the concept of “phonon‐liquid electron‐crystal.” Next, some commonly adopted strategies for further improving their thermoelectric performance are highlighted. The main progress achieved in the typical liquid‐like TE materials is then summarized, with an emphasis on their diverse crystal structures, common characteristics, and unique transport properties. The recent understandings on the stability issue of liquid‐like TE materials are also introduced. Finally, an outlook is given for the liquid‐like materials with the aim to boost further development in this exciting scientific subfield.

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“…Each cation vacancy in is responsible for one hole in its valence band [3,7]. It seems likely that the same refers to the substitutional solid solu tions.…”

Section: Electronic Thermoelectric Power Calculation Proceduresmentioning

confidence: 99%

“…The high temperature phase α Cu 2 S (fcc structure) has a band gap of 1.7-2.0 eV. Carrier mobility in the α phase decreases with increasing temperature as Т -3/2 , suggesting that scat tering by acoustic phonons prevails [6,7]. The hole effective mass in α Cu 2 S has variously been reported to be from 0.58m e to 2.3m e .…”

Section: Introductionmentioning

confidence: 99%