On the factors affecting the dissolution of copper in molten lead‐free solders and development of a method to assess the soldering parameters

Maio, D. Di; Hunt, C

doi:10.1108/09540910910989402

Cited by 7 publications

(1 citation statement)

References 13 publications

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“…With the increase of soldering time, the thickness of Cu 6 Sn 5 becomes thick, but the grow rate of Cu 6 Sn 5 decreases. This is mainly due to the formation of Cu 6 Sn 5 obstacles the diffusion between Cu atoms and Sn atoms (Di Maio and Hunt, 2009;Mannan and Clode, 2004). To further understand its growth mechanisms, the relationship between the measured Cu 6 Sn 5 layer (y) and the soldering time (t) can be modeled with an empirical power law relationship as in equation ( 2…”

Section: The Interfacial Cu 6 Sn 5 Layer Growth Indexmentioning

confidence: 99%

Growth kinetics of IMC at the solid Cu/liquid Sn interface

Zhang

Sun

Liu

2018

SSMT

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Purpose The purpose of this paper is to investigate growth kinetics of interfacial Cu-Sn intermetallic compound (IMC) at the solid Cu/liquid Sn interface. Design/methodology/approach The Sn/Cu solid–liquid interfacial IMCs are fabricated under various soldering temperatures (240°C-270°C) and soldering times (5-240 s) by dipping method. The thickness and morphology of IMC are observed and analyzed by the optical microscope and scanning electron microscope. Findings Holding at 260°C, Cu/Sn solid–liquid interface Cu6Sn5 growth index experience a change from 0.08 to 0.30 within 10-190 s. The growth index is 0.08 in 10-40 s; the growth index is 0.30 in 40-190 s. Cu6Sn5 grain coarsening index is constant within 10-190 s. It is 0.13. The result of the index of Cu6Sn5 grain coarsening is different from predecessors 27 results Cu6Sn5 grain coarsening index for 1/3. This is because Cu6Sn5 grain grows at the expense of its near small grain to reduce the surface Gibbs free energy, and its morphology changes from regular shape to irregular shape. It sets up the mathematical expression about the initial formation time and temperature of Cu3Sn in 240°C-270°C. Originality/value It obtains a mathematical model to express the changes of solid–liquid interface frontier concentration which has an effect on the interfacial Cu6Sn5 layer growth index and the Cu6Sn5 grain coarsening index. Different indexes can be obtained by establishing relevance equations, which can be used to predict the growth of the interface IMC layer. This mathematical model is established to design the solder pads and the sizes of the solder joints.

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Section: The Interfacial Cu 6 Sn 5 Layer Growth Indexmentioning

confidence: 99%

Growth kinetics of IMC at the solid Cu/liquid Sn interface

Zhang

Sun

Liu

2018

SSMT

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Effect of Ge addition on wettability, copper dissolution, microstructural and mechanical behavior of SnCu–Ge solder alloy

Hasnine

Tolla

Karasawa

2017

J Mater Sci: Mater Electron

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Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin

Wang

2020

Journal of Elec Materi

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With the development trend of high speed, light weight, continual miniaturization, and multifunctionality of microelectronic products, the size of solder joints continues to shrink. Therefore, higher requirements are being placed on soldering techniques. This study used the immersion method to investigate the dissolution kinetics of copper in liquid tin at temperatures in the range of 240-300°C with ultrasonic and current coupling. The amount of dissolution and the thickness of the interfacial intermetallic compound (IMC) layer were measured and the dissolution activation energy was calculated. Results showed that the composite fields of ultrasonic and current coupling accelerated copper dissolution in liquid tin and decreased the dissolution activation energy. The dissolution rate was 5-7 times higher compared to that without ultrasound and current, and was 2-3 times higher compared to that using only current. At a certain temperature, with the increase in immersion time, the thickness of the interface IMC layer demonstrated parabolic growth. The sound pressure caused by the ultrasound and the temperature gradient caused by current in the liquid tin were simulated by finite element modeling. The results show that the sound pressure distribution in liquid tin was uneven, and the temperature gradient inside the liquid tin increased with current.

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On the factors affecting the dissolution of copper in molten lead‐free solders and development of a method to assess the soldering parameters

Cited by 7 publications

References 13 publications

Growth kinetics of IMC at the solid Cu/liquid Sn interface

Growth kinetics of IMC at the solid Cu/liquid Sn interface

Effect of Ge addition on wettability, copper dissolution, microstructural and mechanical behavior of SnCu–Ge solder alloy

Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin

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