On the Heat Transfer Characteristics of Heat Sinks: With and Without Vortex Generators

Yang, Kai-Shing; Jhong, Jhih-Hao; Lin, Yung-Chi; Chien, Kuo-Hsiang; Wang, Chi-Chuan

doi:10.1109/tcapt.2010.2044412

Cited by 27 publications

(8 citation statements)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This is because the fin thickness is usually thin and creating cavity in one side will cause dimple on the other side. Test results by Yang et al [35,36] had confirmed that using full cavity/dimple design alongside the surface (e.g., Yang et al [35,36]) is simply futile. Hence, use fewer combinations of dimple/cavity will suffice when employs the shrinkage enhancement structure.…”

Section: Heat Sinkmentioning

confidence: 99%

“…In fact, a recent study by Wang et al [34] had mentioned that the semi-dimple LVG can be more effective than the louver fin geometry for fin-and-tube heat exchanger with fewer number of tube row. For electronic cooling using LVG, Yang et al [35,36] had experimentally examined various types of vortex generator, such as delta wing, triangular winglet, semi-circular, and dimples having loose and dense density. The LVG tested by Yang et al [35] is depicted in Figure 10 and the fin pattern, fin pitch, fin numbers and LVG pitch, and opening angle is tabulated in Table types.…”

Section: Heat Transfer Augmentation Via Fin Configurationmentioning

confidence: 99%

“…For electronic cooling using LVG, Yang et al [35,36] had experimentally examined various types of vortex generator, such as delta wing, triangular winglet, semi-circular, and dimples having loose and dense density. The LVG tested by Yang et al [35] is depicted in Figure 10 and the fin pattern, fin pitch, fin numbers and LVG pitch, and opening angle is tabulated in Table types. Yet the pressure drop of dense delta LVGs is higher than that of loose delta LVGs and that of LVGs + plain fin.…”

Section: Heat Transfer Augmentation Via Fin Configurationmentioning

confidence: 99%

Section: Heat Transfer Augmentation Via Fin Configurationmentioning

confidence: 99%

See 3 more Smart Citations

A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress

Wang

2017

Inventions

View full text Add to dashboard Cite

Abstract:This study provides an overview regarding enhancement of an air-cooled heat sink applicable for electronic cooling subject to cross-flow forced convection. Some novel designs and associated problems in air-cooled heat sinks are discussed, including the drawback of adding surfaces, utilization of porous surfaces such as metal foam or carbon foam, problems and suitable applicable range of highly interrupted surfaces (louver or slit) and longitudinal vortex generator. Though the metal foam may accommodate significant surface area, it is comparatively ineffective for air-cooling application due to its much lower fin efficiency, and this shortcoming can be improved by integrating with solid fin. For highly dense fin spacing (e.g., <1.0 mm), cannelure or grooved surface may be a better choice, and fin structure with periodic contraction and expansion may not be suitable for it introduces additional pressure drop penalty. The partial bypass concept, which manipulates a larger temperature difference at the trailing part of heat sink, can be implemented to significantly reduce the pressure drop. Through some certain niche operation, t the thermal resistance of the partial bypass heat sink may be superior to the conventional heat sink. The trapezoid fin surface featuring easier manufacturing and a smaller weight is shown to have competitive performance against traditional rectangular fin geometry. The IPFM (Interleaved Parallelogram Fin Module) design which combines two different geometrical fins with the odd number fins being rectangular shape, and parallelogram shape in even fin numbers, shows 8%-12% less surface than conventional design but still offers a lower thermal resistance than the conventional rectangular heat sink in lower flowrate operation. The cross-cut design shows appreciable improvements as compared to the conventional plate fin design especially in high velocity regime and the single cross-cut heat sinks are superior to multiple cross-cut heat sinks.

show abstract

Section: Heat Sinkmentioning

confidence: 99%

Section: Heat Transfer Augmentation Via Fin Configurationmentioning

confidence: 99%

Section: Heat Transfer Augmentation Via Fin Configurationmentioning

confidence: 99%

Section: Heat Transfer Augmentation Via Fin Configurationmentioning

confidence: 99%

See 2 more Smart Citations

A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress

Wang

2017

Inventions

View full text Add to dashboard Cite

show abstract

“…They can take various forms such as protrusions, wings, inclined blocks, winglets, fins, and ribs [13,14], and have been used to enhance heat transfer in different geometries such as circular and noncircular ducts under turbulent flow [15][16][17]. They have also been used in laminar flow [18], with flat plate-fins in rectangular channels [19][20][21], tube heat exchangers [22], heat sinks [18,23] and rectangular narrow channels [24,25].…”

Section: Introductionmentioning

confidence: 99%

Heat transfer enhancement in a micro-channel cooling system using cylindrical vortex generators

Al-Asadi

Alkasmoul

Wilson

2016

International Communications in Heat and Mass Transfer

View full text Add to dashboard Cite

Three-dimensional conjugate heat transfer under laminar flow conditions within a microchannel is analysed numerically to explore the impact of a new design of vortex generator positioned at intervals along the base of the channel. The vortex generators are cylindrical with quarter-circle and half-circle cross sections, with variants spanning the whole width of the channel or parts of the channel. Micro-channels with Reynolds number ranging from 100 to 2300 are subjected to a uniform heat flux relevant to microelectronics cooling. To ensure the accuracy of the results, validations against previous microchannel studies were conducted and found to be in good agreement, before the new vortex generators with radii up to 400 µm were analysed. Using a thermal-hydraulic performance parameter expressed in a new way, the VGs described here are shown to offer significant potential in combatting the challenges of heat transfer in the technological drive toward lower weight/smaller volume electrical and electronic devices.

show abstract

Vortex Generators

Saha¹,

Ranjan²,

Emani³

et al. 2019

Heat Transfer Enhancement in Plate and Fin Extended Surfaces

View full text Add to dashboard Cite

On the Heat Transfer Characteristics of Heat Sinks: With and Without Vortex Generators

Cited by 27 publications

References 10 publications

A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress

A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress

Heat transfer enhancement in a micro-channel cooling system using cylindrical vortex generators

Vortex Generators

Contact Info

Product

Resources

About