On the influence of the surface roughness onto the ultrathin SiO2/Si structure properties

Jurečka, Stanislav; Kobayashi, Hikaru; Takahashi, Masatoshi; Matsumoto, Tetsuya; Jurečková, Mária; Chovanec, Ferdinand; Pinčík, Emil

doi:10.1016/j.apsusc.2010.03.030

Cited by 12 publications

(10 citation statements)

References 16 publications

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“…[12] The surface roughness of the semiconductor substrate substantially influences properties of the whole semiconductor/oxide structure. [13] The growth of thin films is complex, and their surfaces exhibit complex structures that are difficult to be quantitatively characterized by conventional methods. A fractal model is usually employed to describe the morphology of surface.…”

Section: Introductionmentioning

confidence: 99%

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Multifractal analysis for Cu/Ti bilayer thin films

Lin

Yang

Wang

et al. 2013

Surface & Interface Analysis

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a Two bilayer thin films with different stacking sequences, Cu/Ti/Si and Ti/Cu/Si, were deposited by DC magnetron sputtering technique. X-ray diffraction technique was used to measure the crystallization structures, and scanning electron microscopy and atomic force microscopy were used to measured surface morphology. The multifractal spectra f(a)-a was used to characterize the surface morphology. The result of |q| max ≤ 53 is obtained by multifractal analysis. The shape of the multifractal spectra f(a) À a is hook-like for Cu/Ti/Si and bell jar-like for Ti/Cu/Si. The spectrum width Δa = a max À a min and Δf(=f(a min ) À f(a max )) of the multifractal spectra is able to quantitatively analyze the growth and surface roughness of the Cu/Ti bilayer thin films. The surface of Ti/Cu/Si thin film is more uniform and smoother than the film of Cu/Ti/Si.

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Section: Introductionmentioning

confidence: 99%

“…For example, surface roughness of Cu interconnects results the increase of resistivity up to 50% . The surface roughness of the semiconductor substrate substantially influences properties of the whole semiconductor/oxide structure …”

Section: Introductionmentioning

confidence: 99%

Multifractal analysis for Cu/Ti bilayer thin films

Lin

Yang

Wang

et al. 2013

Surface & Interface Analysis

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“…AFM overcomes almost all the above drawbacks of the stylus profiler. In recent years, AFM has been widely used for semiconductors to obtain the surface image in the nanometer scale [25][26][27]. During machining, the discharge energy produces very high temperatures at the point of the spark on the surface of the workpiece removing the material by melting and vaporization.…”

Section: Introductionmentioning

confidence: 99%

Electrical Discharge Machining

Guu

Hocheng

2012

Advanced Analysis of Nontraditional Machining

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Electrical discharge machining (EDM) is considered suitable for machining materials that are extremely hard or strong, and are wear or temperature resistant. In Chap. 2, we outline EDM characteristics of carbon fiber-reinforced carbon composites and AISI D2 tool steel. This article is organized as follows: first, the effects of EDM processing variables on delamination, the recast layer, surface roughness, and material removal rate (MRR) of carbon fiber-reinforced carbon composites are presented. Rotation of the workpiece allows fresh dielectric material to enter for effective spark discharge, and to provide better machining performance. Therefore, the second section of this chapter is devoted to a study of the effects of rotary EDM parameters on MRR and surface roughness of AISI D2 tool steel. The EDM process produces a damaged layer with different mechanical behaviors from those of the base metal. An understanding of the strength of an EDM sample is required. The third section describes an investigation of EDM AISI D2 tool steel surface characteristics and machining damage. EDM damage was studied using a new damage variable. An understanding of the surface texture of EDM specimens on the nanoscale is required. In the fourth section, surface morphology, surface roughness, and micro-cracks of AISI D2 tool steel machined by the EDM process were analyzed by atomic force microscopy (AFM). Experimental results show that the thickness of the recast layer, micro-crack depth, surface roughness, and residual tensile stress increase with the increase in power input. The EDM process effectively produces excellent surface characteristics in specimens, under low discharge energy conditions.

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“…Most of the existing techniques for measuring surface uniformity are manual and requires manual intervention like profilers that capture the surface roughness with the help of a profiling tool. [11] AFM images are used to measure root mean square roughness, which helps in analyzing the surface characteristics of nanostructures. [12] Scattering techniques have also been used for analyzing the surface roughness.…”

Section: Introductionmentioning

confidence: 99%

Uniformity analysis in nanocrystalline silver thin films using fuzzy inference system

John

Nair

Gopchandran

et al. 2014

Surf. Interface Anal.

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An automatic and efficient technique to analyze the uniformity of nanoscale images using wavelets, feature similarity index measure (FSIM) and fuzzy inference system is reported. It has been successfully tested on scanning electron micrographs of nanocrystalline silver thin films. Thin films are prepared using on-axis and off-axis pulse laser deposition (PLD) technique. It is found that the film prepared using on-axis PLD is more uniformly distributed and has smoother texture compared with that of the off-axis technique. In order to analyze the images quantitatively, they are transformed to the wavelet domain to extract the localized frequency variations and a uniformity measure is derived using a fuzzy inference system for quantitatively analyzing the uniformity of each image. The surface plot of the FSIM values of the image is found to be an efficient tool for nanoscientists to evaluate the smoothness of the thin film surfaces. This study is expected to help the nanoscientists to understand these nanostructures in detail.

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On the influence of the surface roughness onto the ultrathin SiO2/Si structure properties

Cited by 12 publications

References 16 publications

Multifractal analysis for Cu/Ti bilayer thin films

Multifractal analysis for Cu/Ti bilayer thin films

Electrical Discharge Machining

Uniformity analysis in nanocrystalline silver thin films using fuzzy inference system

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