1994
DOI: 10.1115/1.2901802
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On the Possibility of Process Monitoring in Grinding by Spark Intensity Measurements

Abstract: Precision manufacturing processes like grinding are capable of producing parts to high dimensional accuracies and excellent surface finish. Process monitoring is critical in grinding to achieve accuracy, finish and surface integrity. In this paper an attempt has been made to explore the possibility of process monitoring in grinding by spark field measurements. After establishing the correlation between the chip sizes and roughness produced in grinding, a thermal model is presented showing the relationship betw… Show more

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Cited by 4 publications
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“…Measuring the temperatures T wmean , T gmean , and T c , the thermal partition coefficients β w , β g and β c are calculated from the above equations (4), (9) and (10). Measurement of workpiece temperature is relatively easy among three kinds of temperatures.…”
Section: Thermal Partition Coefficientmentioning
confidence: 99%
“…Measuring the temperatures T wmean , T gmean , and T c , the thermal partition coefficients β w , β g and β c are calculated from the above equations (4), (9) and (10). Measurement of workpiece temperature is relatively easy among three kinds of temperatures.…”
Section: Thermal Partition Coefficientmentioning
confidence: 99%
“…This is owing to the high load on the grains and the clogging of high-temperature chips on to the bonding material. In practical situations, the wear mechanisms may occur simultaneously with different intensities, depending upon the cutting parameters, cutting fluid, grinding wheel specification, workpiece material, and type of grinding operation [5]. All these wear mechanisms contribute to the changes in the grinding wheel topography.…”
Section: Grinding Wheel Wearmentioning
confidence: 99%
“…The efficiency of the cooling process in grinding is therefore important in order to increase the reliability of the process and improve the surface quality of the machined parts. The application of a video camera for monitoring the grinding process based on the sparks generated by the process it has been reported in previous research [6]. Some researchers, see [22], used thermal modelling to estimate the heat generated by a grinding process and to prevent thermal damage.…”
Section: Grinding Processmentioning
confidence: 99%
“…This could reduce the flexibility and the reliability of the monitoring process by monitoring a signal rather than a complete image. Other methods such as force [6], acoustic emission [24], laser triangulation [25] and mircomegnitic techniques [26] have also been used. This paper investigates the applicability of a low-cost infrared imager for monitoring grinding processes.…”
Section: Grinding Processmentioning
confidence: 99%
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