On the Role of Bonding Time on Microstructure and Mechanical Properties of TLP Bonded Al/Mg2Si Composite

Abstract

Transient liquid phase diffusion bonding of an aluminum metal matrix composite with 15 wt.% Mg2Si reinforcement particles using Cu powder interlayer at 560 °C for different bonding times has been studied. Three different zones were identified at the bonding line: athermally solidified zone, isothermally solidified zone and base metal. By increasing the bonding time, due to the diffusion of copper to the substrate, the width of the athermally solidified zone decreased, became more homogenous and the amount of intermetallic phase (CuAl2) decreased. Therefore, the shear strength increased to a maximum of 60 MPa for the samples with a holding time of 5 h at the bonding temperature.