On the Room-Temperature Creep Behavior and Its Correlation with Length Scale of a LiTaO3 Single Crystal by Spherical Nanoindentation

Hang, Wei; Huang, Xianwei; Liu, Min; Ma, Yi

doi:10.3390/ma12244213

Cited by 7 publications

(3 citation statements)

References 36 publications

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“…As the surface of LiTaO 3 wafer suffers long-term point-contact deformation during grinding and polishing, nanoindentation exploration has attracted lots of attentions on revealing the mechanical properties and deformation features of LiTaO 3 at the microscale [ 24 , 25 , 26 , 27 ]. In the authors’ previous work, room-temperature creep deformation was reported in this high-melting-point ceramic [ 28 , 29 ], and cracking is the dominating deformation mode under high-load nanoindentation for brittle solids, which could be directly detected from the surface morphology of residual impression. Relying on nanoindentation technology, researchers investigated the fracture features and estimated the fracture toughness in a lot of brittle ceramics and their composites [ 30 , 31 , 32 ].…”

Section: Introductionmentioning

confidence: 99%

Revealing the Plastic Mode of Time-Dependent Deformation of a LiTaO3 Single Crystal by Nanoindentation

Zhou

Huang

et al. 2020

Micromachines

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Recently, instrumental nanoindentation has been widely applied to detect time-dependent plastic deformation or creep behavior in numerous materials, particularly thin films and heterogeneous materials. However, deformation mechanism at nanoindentation holding stage has not been well revealed hitherto. In the current work, nanoindentation holding tests with high loads were performed on a brittle LiTaO3 single crystal. The surface morphologies of residual impressions with various holding times were investigated. It was indicated that generation of secondary cracks and propagation of both main and secondary cracks were the dominating mechanism for time-dependent plastic deformation at the initial holding stage, and the density and length of cracks were invariable at the steady-state holding stage, which suggested a nonlocalized plastic deformation beneath the indenter. It could be concluded that time-dependent plastic deformation of brittle ceramic under nanoindentation is composed of instant cracking as the continuation of loading sequence and homogeneous creep flow by high shear-compression stress at room temperature.

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Section: Introductionmentioning

confidence: 99%

Revealing the Plastic Mode of Time-Dependent Deformation of a LiTaO3 Single Crystal by Nanoindentation

Zhou

Huang

et al. 2020

Micromachines

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“…However, owing to the brittle nature of LiTaO 3 , surface defects, such as digs, scratches, dislocations, microcracks, cleavages, subsurface damage, and edge chipping, are observed during the CMP process [7]. Moreover, as the thickness of LiTaO 3 becomes thinner, the impact of surface defects on crack nucleation increases, leading to a higher risk of fracture in the LiTaO 3 [8]. To identify the cause of the mentioned defects that directly affect the performance of SAW devices, research is being conducted on the mechanical characteristics considered in machining, such as grinding, lapping, and polishing.…”

Section: Introductionmentioning

confidence: 99%

An Analysis of Edge Chipping in LiTaO3 Wafer Grinding Using a Scratch Test and FEA Simulation

2023

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Lithium tantalite (LiTaO3) is a representative multifunctional single-crystal material with electro-optical, acoustic, piezoelectric, pyroelectric, and nonlinear optical properties used as a substrate for surface acoustic wave (SAW) devices. To enhance SAW device performance, thinner LiTaO3 substrates with improved surface roughness are desired. Chemical mechanical polishing (CMP) is employed to achieve the desired surface roughness after grinding. However, the thinning process increases the risk of substrate fracture, especially at the edges, resulting in edge chipping. Edge chipping can lead to complete substrate failure during SAW device fabrication, requiring an effective wafer geometry to prevent it. The study utilizes scratch tests and finite element analysis (FEA) to identify the optimal edge shape (C-cut, trimmed, and thinned) for preventing edge chipping on LiTaO3 wafers. The C-cut edge refers to the rounding of the wafer’s edge, while the trimmed edge refers to the machining of the wafer’s edge to be perpendicular to the wafer surface. As a result of the scratch tests, we observed edge-chipping lengths of 115 and 227 μm on the C-cut and trimmed edges, respectively, while the thinned edge (half C-cut) resulted in complete wafer fracture. In the finite element analysis (FEA), edge-chipping lengths of 80, 120, and 150 μm were obtained on the C-cut, trimmed, and thinned edges (half C-cut), respectively. In conclusion, it has been confirmed that the C-cut, trimmed, and thinned edge shapes are effective in preventing edge chipping. However, considering that the C-cut edge shape becomes thinner through grinding, using the trimmed edge shape appears to be the most effective.

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“…Because of these benefits, the piezoelectric actuator has been widely used in a variety of industries, including space exploration [15,16], active shutters, pulsed jets [17][18][19], vibration control [20][21][22][23][24], optical path control [25][26][27][28], micro-motorization of instruments [29,30], valves and pumps for implants [31][32][33][34][35][36], magnetic resonance imaging (MRI) [37,38], microsurgery [39][40][41][42], and other micro-displacement techniques [43][44][45][46][47][48]. Position control is severely hindered by the unique piezoelectric actuator structure, nonlinear hysteresis behaviors, and additional sources of positioning precision loss, such as creep drift and temperature effects [49][50][51][52][53]. Extensive study has been done for the modeling and control of the nonlinearity of hysteresis.…”

Section: Introductionmentioning

confidence: 99%

Hybrid Approach Control of Micro-Positioning Stage with a Piezoelectric Actuator

Ounissi¹,

Kaddouri²,

Abdessemed³

2022

JISC

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For a class of system with nonlinear hysteresis, this paper presents an adaptive hybrid controller based on the hybrid backstepping-sliding mode, and describes the controller analytically by the LuGre model. Both backstepping and the sliding mode techniques are based on the Lyapunov theory. Drawing on this common point, the authors developed a new controller combining the two control techniques with a recursive design. The design aims to achieve two effects: assuring the stability of the closed loop system, and improving the continuous performance of the tracking position trajectory. The performance of the proposed hybrid controller was verified by implementing the identified Piezo model. The results show that our controller can track the system output desirably with the reference trajectory.

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On the Room-Temperature Creep Behavior and Its Correlation with Length Scale of a LiTaO3 Single Crystal by Spherical Nanoindentation

Cited by 7 publications

References 36 publications

Revealing the Plastic Mode of Time-Dependent Deformation of a LiTaO3 Single Crystal by Nanoindentation

Revealing the Plastic Mode of Time-Dependent Deformation of a LiTaO3 Single Crystal by Nanoindentation

An Analysis of Edge Chipping in LiTaO3 Wafer Grinding Using a Scratch Test and FEA Simulation

Hybrid Approach Control of Micro-Positioning Stage with a Piezoelectric Actuator

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