“…Our method for designing a resistive distributed structure as to obtain a specific transfer characteristic follows two steps [1], [2]: i) first, the positions of the conductive segments on a standard domain (upper complex half-plane) is determined, as to obtain the desired transfer characteristics and to obey the constraints imposed by the distributed nature of the structure; ii) starting from these results, a particular geometry of the distributed domain can be chosen (from an infinite possible variety), as to obtain the most favorable production conditions and and to fulfill several other second order effects important for production and usage. For production that means high robustness, so trimming would not be needed; for usage the second order effects can refer to the most favorable positions and dimensions of the conductive terminals on the structure's boundary, the most advantageous electric, magnetic or thermic field pattern in the distributed domain as to avoid crowding and stress and so on.…”