On the temperature dependence of the excess resistivity in dilute volatile alloys

Uray, L.; Vicsek, Tamás

doi:10.1080/01418637808227675

Cited by 11 publications

(2 citation statements)

References 8 publications

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“…2) by measuring the thermopower of the specimens. I n this material an empirical linear relation has been found between the analytical iron content and the thermopower, provided to obtain the true temperature dependence of Ae [5].…”

Section: Methodsmentioning

confidence: 99%

“…The iron concentration also On the left-hand side the position of the specimens in the sintered bar is shows. The dashed line gives the theoretical evaporation profile for a volatile impurity [7] varies in the radial direction within a single bar, because iron is volatile in tungsten [5]. To obtain sufficiently homogeneous samples, the bar was cut into longitudinal pieces as shown in Fig.…”

Section: Methodsmentioning

confidence: 99%

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The effect of void size on the resistivity of sintered tungsten

Uray

1984

Phys. Stat. Sol. (a)

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Electrical resistivity is measured from 4.2 to 300 K on sintered tungsten to determine the resistivity contribution of random electron scattering on voids. The resistivity contribution is obtained in two steps: at first the excess resistivity is determined from the resistivity ratio, which is unsensitive to the current flow around voids. In the second step the excess resistivity is separated into contributions due to solutes and void scattering. The effect of solutes is taken into account by measuring also the thermopower. From the resistivity Contribution of the voids the average void size is derived by means of a simple scattering model. The derived void size is in fair agreement with the observed one.

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Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

The effect of void size on the resistivity of sintered tungsten

Uray

1984

Phys. Stat. Sol. (a)

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Thermotransport of volatile impurities

Csépes

Gaal

1980

Phys. Stat. Sol. (a)

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The thermotransport connected with the radial temperature gradient in resistance heated cylindrical rods may influence both the evaporation rate and profile of the volatile solutes. The extent of this effect is calculated for various heats of transport and sample sizes and the influence of the temperature dependence of the diffusion coefficient is also investigated. Also the possibility of the experimental determination of the heat of transport from the evaporation profile is discussed.

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Effect of Grain Boundaries on the Out-Diffusion Rate of Volatile Solutes from Thin Wires

Gaal

Neugebauer

1985

phys. stat. sol. (a)

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The out diffusion rate of a volatile diffusant is determined by solving the coupled grain boundary and bulk diffusion problem for a cylindrical rod with an array of equally spaced grain boundaries lying normal to the rod axis. This grain structure may be taken as a model for the common bamboo structure of well annealed pure wires. For long diffusion periods (t > 0.1a2/D), the average concentration of the retained diffusant decay exponentially in an excellent approximation. From the decay parameter one can evaluate an apparent diffusion coefficient, Da, which gives useful bounds at the typical grain aspect ratio of the bamboo structure for the bulk diffusion coefficient: 0.93Da ≦ D ≦ Da.

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On the temperature dependence of the excess resistivity in dilute volatile alloys

Cited by 11 publications

References 8 publications

The effect of void size on the resistivity of sintered tungsten

The effect of void size on the resistivity of sintered tungsten

Thermotransport of volatile impurities

Effect of Grain Boundaries on the Out-Diffusion Rate of Volatile Solutes from Thin Wires

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