On the use of vias in conductor-backed coplanar circuits

Haydl, W.H.

doi:10.1109/tmtt.2002.1006419

Cited by 112 publications

(54 citation statements)

References 19 publications

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“…Considering the dimensions of the proposed Butler matrix, it was verified that the lowest order mode resonance frequency has been shifted to a higher frequency regime. In this case, it can be noted that the leaky wave phenomenon does not affect the performance of the proposed Butler matrix, thus avoiding use of vias [24].…”

Section: × 4 Butler Matrixmentioning

confidence: 93%

Novel Wideband Multilayer Butler Matrix Using Cb-CPW Technology

Kilani¹,

Nedil²,

Kandil³

et al. 2012

PIER C

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Abstract-This paper presents a novel design of a 4 × 4 twolayer wideband Butler matrix using a CB-CPW wideband multilayer directional coupler as well as a novel CB-CPW wideband elliptic directional coupler. With this configuration, the proposed matrix was designed to avoid crossovers as in conventional Butler matrices, thus reducing its size, losses and the design complexity while leading to a broad bandwidth of 3 GHz. To evaluate the performance of the proposed matrix, experimental prototypes of the directional elliptic coupler, the CB-CPW multilayer directional coupler and Butler matrix were fabricated and measured. Furthermore, a 4-element antenna array was connected to the matrix to form a beamforming antenna system at 5.8 GHz. As a result, four orthogonal beams were realized in the band 4.5-7.5 GHz.

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Section: × 4 Butler Matrixmentioning

confidence: 93%

Novel Wideband Multilayer Butler Matrix Using Cb-CPW Technology

Kilani¹,

Nedil²,

Kandil³

et al. 2012

PIER C

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“…2, is used for impedance matching. The use of vias to connect back and side ground planes eliminates unwanted parallel-plate modes [21]. Fig.…”

Section: Conductor-backed Coplanar Waveguidementioning

confidence: 99%

A Wideband 77-GHz, 17.5-dBm Fully Integrated Power Amplifier in Silicon

Komijani

Hajimiri

2006

IEEE J. Solid-State Circuits

111

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Abstract-A 77-GHz, +17.5 dBm power amplifier (PA) with fully integrated 50-input and output matching and fabricated in a 0.12-m SiGe BiCMOS process is presented. The PA achieves a peak power gain of 17 dB and a maximum single-ended output power of 17.5 dBm with 12.8% of power-added efficiency (PAE). It has a 3-dB bandwidth of 15 GHz and draws 165 mA from a 1.8-V supply. Conductor-backed coplanar waveguide (CBCPW) is used as the transmission line structure resulting in large isolation between adjacent lines, enabling integration of the PA in an area of 0.6 mm 2 . By using a separate image-rejection filter incorporated before the PA, the rejection at IF frequency of 25 GHz is improved by 35 dB, helping to keep the PA design wideband.

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“…The bottom layer is used as the ground plane and must be kept free of large holes when traces must be routed on it. Like most multi-layered boards, these two layers can act as a microstrip patch antenna and can generate undesired radiation [6,12,13]. To avoid this problem, the filled areas of the top layer are stitched with the bottom ground plane using vias.…”

Section: System-level Effects -Feed Networkmentioning

confidence: 99%

“…The effectiveness of the vias depends on their placements on the PCB. They must be placed near the edges of the two conducting layers to suppress parallel-plate modes and fringing fields of the unwanted patch antenna [6]. The vias should be placed apart less than half wavelength to avoid resonance [12].…”

Section: System-level Effects -Feed Networkmentioning

confidence: 99%

Design methodology for wireless nodes with printed antennas

Chenard¹,

Zilic²,

Chu³

et al. 2005

Proceedings. 42nd Design Automation Conference, 2005.

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The need for mass-produced inexpensive wireless devices operating under strict energy constraints poses new challenges in the system design methodology. This paper presents a methodology for designing wireless nodes in which a low cost, reliable antenna is realized by printed circuit traces. We show how to combine the analysis from 2.5D and 3D EM simulators with the PCB design tools to create predictable nodes with printed antennas that meet stringent power and data transmission range goals. The presented approach is applied to the design of a IEEE802.15.4 wireless node deployed in several indoor environments.

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On the use of vias in conductor-backed coplanar circuits

Cited by 112 publications

References 19 publications

Novel Wideband Multilayer Butler Matrix Using Cb-CPW Technology

Novel Wideband Multilayer Butler Matrix Using Cb-CPW Technology

A Wideband 77-GHz, 17.5-dBm Fully Integrated Power Amplifier in Silicon

Design methodology for wireless nodes with printed antennas

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