“…There are several classes of problems pertaining to the issue of three-dimensional stress singularity: (i) through-thickness crack [22,23,[37][38][39][40][41] and their bimaterial interface [24] as well as trimaterial counterparts [24,28], (ii) through-thickness notches/wedges [12,[25][26][27]31], (iii) trimaterial junction [29,48], (iv) penny shaped crack/anticrack [49][50][51] and their bimaterial counterparts [52][53][54], (v) through/part-through hole/rigid inclusion [55] as well as their bimaterial counterparts [56,57], (vi) elastic inclusion [58], (vii) fiber-matrix interfacial debond [59][60][61][62], and (viii) island/substrate system [62]. If any of these stress singularities occurs in the gage section of a tensile (or compressive) test specimen, the interaction of such a singularity with its edge face (free edge in two dimension) counterpart at the plate boundary [32][33][34][35][36], would result in violation of Saint-Venant's principle.…”