2019
DOI: 10.1111/str.12330
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One‐step deposition of nano‐to‐micron‐scalable, high‐quality digital image correlation patterns for high‐strain in‐situ multi‐microscopy testing

Abstract: Digital image correlation (DIC) is of vital importance in the field of experimental mechanics, yet producing suitable DIC patterns for demanding in-situ (micro) mechanical tests remains challenging, especially for ultrafine patterns, despite the large number of patterning techniques reported in the literature. Therefore, we propose a simple, flexible, one-step technique (only requiring a conventional physical vapour deposition machine) to obtain scalable, high-quality, robust DIC patterns, suitable for a range… Show more

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Cited by 44 publications
(29 citation statements)
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References 57 publications
(86 reference statements)
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“…A limitation of the technique is that very high pattern density, such as reported for thin-film remodeling based techniques [14,16,20], might not be possible. The density of the pattern seems to saturate with an average particle to particle spacing (center to center) of ∼4-6 times the particle diameter.…”
Section: Pattern Scalabilitymentioning
confidence: 99%
See 1 more Smart Citation
“…A limitation of the technique is that very high pattern density, such as reported for thin-film remodeling based techniques [14,16,20], might not be possible. The density of the pattern seems to saturate with an average particle to particle spacing (center to center) of ∼4-6 times the particle diameter.…”
Section: Pattern Scalabilitymentioning
confidence: 99%
“…Another significant alteration to the sputter-deposition based DIC patterning technique was recently reported by Hoefnagels et al [20], which also does not require a hightemperature remodeling step nor does it require immersion into a liquid. The technique hinges on sputter deposition of a low-temperature solder (e.g.…”
Section: Introductionmentioning
confidence: 99%
“…Recent advances in the speckle pattern deposition allow producing consistent and controlled nanoscale patterns using simple methods, such as physical vapour deposition or multi-layer sputtering [95,96]. Additionally, improvements of the image correlation algorithms provide more information on the initiation and evolution of fibre-matrix decohesion [97].…”
Section: In Situ Mechanical Testing In Sem Coupled To Dicmentioning
confidence: 99%
“…Through recent advances in experimental mechanics, (in-situ) mechanical characterization of polycrystalline and multiphase metals at small scales is increasingly more accessible. Particularly, the development of Digital Image Correlation (DIC) patterning methods for in-situ Scanning Electron Microscopy based DIC (SEM-DIC) has lead to the capability of observing plastic deformation mechanisms from micrometer to nanometer scales [13,14,15,16,17,18]. In practice, SEM-DIC testing of these metals is commonly performed on bulk samples that are (mechanically) polished, of which the microstructure is characterized (with, e.g., Electron Backscatter Diffraction (EBSD)), that are subsequently decorated with a DIC speckle pattern, and are finally tested by means of in-situ SEM-DIC, resulting in plastic strain fields over a certain millimeter or micrometer sized area in the microstructure [10,11,15,19,20,21,22,23,24,25,26].…”
Section: Introductionmentioning
confidence: 99%