One-step large-scale synthesis of micrometer-sized silver nanosheets by a template-free electrochemical method

Park, Sun Hwa; Son, Jin Gyeong; Lee, Tae Geol; Park, Hyun Min; Song, Jianwei

doi:10.1186/1556-276x-8-248

Cited by 26 publications

(18 citation statements)

References 25 publications

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“…Due to the fast nucleation and growth of nanocrystals, non-equilibrium processes are important for synthesizing interesting structures with hierarchical morphologies [ 18 , 22 – 25 ]. Recently, electrochemical deposition methods have been used to fabricate various metal structures, including pyramids [ 7 ], flower-like mesoparticles [ 18 ], nanosheets [ 19 ], nanorods [ 20 , 21 ], dendrites [ 22 – 25 ], and concave hexoctahedral nanocrystals [ 26 ].…”

Section: Introductionmentioning

confidence: 99%

Morphology-Controlled Fabrication of Large-Scale Dendritic Silver Nanostructures for Catalysis and SERS Applications

Cheng

et al. 2019

Nanoscale Res Lett

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Highly branched metallic nanostructures, which possess a large amount of catalyst active sites and surface-enhanced Raman scattering (SERS) hot spots owing to their large surface areas, multi-level branches, corners, and edges, have shown potential in various applications including catalysis and SERS. In this study, well-defined dendritic silver (Ag) nanostructures were prepared by a facile and controllable electrochemical deposition strategy. The morphology of Ag nanostructures is controlled by regulating electrodeposition time and concentration of AgNO3 in the electrolyte solution. Compared to conventional Ag nanoparticle films, dendritic Ag nanostructures exhibited larger SERS enhancement ascribed to the numerous hot spots exist in the nanogaps of parallel and vertically stacked multilayer Ag dendrites. In addition, the prepared dendritic Ag nanostructures show 3.2-fold higher catalytic activity towards the reduction of 4-nitrophenol (4-NP) by NaBH4 than the Ag nanoparticle films. The results indicate that the dendritic Ag nanostructures represent a unique bifunctional nanostructure that serves as both efficient catalysts and excellent SERS substrates, which may be further employed as a nanoreactor for in situ investigation and real-time monitoring of catalytic reactions by SERS technique.

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Section: Introductionmentioning

confidence: 99%

Morphology-Controlled Fabrication of Large-Scale Dendritic Silver Nanostructures for Catalysis and SERS Applications

Cheng

et al. 2019

Nanoscale Res Lett

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“…29 It also confirms that the as-prepared silver microsheets exhibit {111} preferential orientation, although they are not as thin as the reported silver sheets. [27][28][29][30]32 When functioning as flaky fillers for ECAs, a suitable thickness might be beneficial for preventing the sheets from winding in the mixing or application processes of ECAs to maintain the large face-to-face contact area of conductive silver sheets.…”

Section: Resultsmentioning

confidence: 99%

One-Step Preparation of Silver Hexagonal Microsheets as Electrically Conductive Adhesive Fillers for Printed Electronics

Ren

Guo

Huang

et al. 2015

ACS Appl. Mater. Interfaces

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A facile one-step solution-phase chemical reduction method has been developed to synthesize Ag microsheets at room temperature. The morphology of Ag sheets is a regular hexagon more than 1 μm in size and about 200 nm in thickness. The hexagonal Ag microsheets possess a smoother and straighter surface compared with that of the commercial Ag micrometer-sized flakes prepared by ball milling for electrically conductive adhesives (ECAs). The function of the reagents and the formation mechanism of Ag hexagonal microsheets are also investigated. For the polyvinylpyrrolidone (PVP) and citrate facet-selective capping, the Ag atoms freshly reduced by N2H4 would orientationally grow alone on the {111} facet of Ag seeds, with the synergistically selective etching of irregular and small Ag particles by H2O2, to form Ag hexagonal microsheets. The hexagonal Ag microsheet-filled epoxy adhesives, as electrically conductive materials, can be easily printed on various substrates such as polyethylene terephthalate (PET), epoxy, glass, and flexible papers. The hexagonal Ag microsheet filled ECAs demonstrate lower bulk resistivity (approximately 8 × 10(-5) Ω cm) than that of the traditional Ag micrometer-sized-flake-filled ECAs with the same Ag content of 80 wt % (approximately 1.2 × 10(-4) Ω cm).

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“…Metal NPs have been prepared by various methods, such as chemical reduction [ 31 ], light-induced reduction [ 32 , 33 ], electrochemical methods [ 34 ], template methods [ 35 ], laser processing methods [ 36 , 37 , 38 , 39 ], and ultrasonic and microwave methods [ 40 , 41 , 42 , 43 ]. Table 1 summarizes the electrical conductivity of mainly typical die-attach systems, and it is easy to find that the electrical conductivities of Ag NP pastes are far higher than the other typical die-attach systems.…”

Section: Interconnections Using Ag Np Pastesmentioning

confidence: 99%

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Yan

2021

Nanomaterials

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Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of using polyol-based Ag NPs for electronic packaging. The synthesis, sintering-bonding process, bonding mechanism, and high-temperature joint properties of Ag NP pastes are investigated. The paste containing a high concentration of Ag NPs was prepared based on the polyol method and concentration. A nanoscale layer of organic components coated on the NPs prevents the coalescence of Ag NPs. The effects of organic components on the bondability of the Ag NP paste were studied. Compared to the aqueous-based Ag NP paste, the polyol-based Ag NP with the reduction of organic component can improve the bondability, and the coffee ring effect was successfully depressed due to the increased Marangoni flow. The sintering behaviors of Ag NPs during the bonding process were investigated using the classical sphere-to-sphere approach. The mechanical property of joints using this Ag paste was better than that using Pb95Sn5 solders after storage at high temperatures. The sintering–bonding technology using polyol-based Ag NPs was helpful to the low-temperature interconnection for electronic packaging applications.

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One-step large-scale synthesis of micrometer-sized silver nanosheets by a template-free electrochemical method

Cited by 26 publications

References 25 publications

Morphology-Controlled Fabrication of Large-Scale Dendritic Silver Nanostructures for Catalysis and SERS Applications

Morphology-Controlled Fabrication of Large-Scale Dendritic Silver Nanostructures for Catalysis and SERS Applications

One-Step Preparation of Silver Hexagonal Microsheets as Electrically Conductive Adhesive Fillers for Printed Electronics

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

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