One-step template-free electrosynthesis of 300μm long copper sulfide nanowires

Ghahremaninezhad, A.; Asselin, Edouard; Dixon, David G.

doi:10.1016/j.elecom.2010.10.032

Cited by 25 publications

(21 citation statements)

References 15 publications

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“…Numerous research papers reporting synthesis of CuS in thin films [8][9][10][11][12][13][14][15][16][17][18], nanoparticles [19][20][21][22][23][24][25][26][27][28][29][30], micro-meter size morphologies [31,32], etc. forms have been reported.…”

Section: Introductionmentioning

confidence: 99%

Covellite CuS – Single crystal growth by chemical vapour transport (CVT) technique and characterization

Chaki

Tailor

Deshpande

2014

Materials Science in Semiconductor Processing

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Section: Introductionmentioning

confidence: 99%

Covellite CuS – Single crystal growth by chemical vapour transport (CVT) technique and characterization

Chaki

Tailor

Deshpande

2014

Materials Science in Semiconductor Processing

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“…[16][17][18]. So far, various nanostructures of CuS, including tubular structure [19][20][21], flower-like morphologies [11,22], urchin-like architecture and snowflake-like pattern [23], plate-like [24], rod-like [25], wire-like [26] and sphere-like [10,27,28] morphologies, etc., have been successfully synthesized via different approaches. However, most of these synthetic methods involved template or complex equipment.…”

Section: Introductionmentioning

confidence: 99%

CuS nanostructures prepared by a hydrothermal method

Huang

Chen

Zhang

et al. 2011

Journal of Alloys and Compounds

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“…1,2,[6][7][8][9][10][11][12][13][18][19][20][21][22][23][24][25][26][27][28][29] TU is a common additive in Cu and Ag electrodeposition baths and induces leveling and grain refining properties.…”

mentioning

confidence: 99%

“…20,21,23,24 Various applications of TU as an additive have been studied, including the formation of the Cu twin, Ag superfilling, and the fabrication of CuS nanowire structures. 18,19,[23][24][25][26] TU is known to form thiolate complexes such as [Cu-(TU) ions. [27][28][29] Owing to the various derivatives and their different electrochemical responses, TU shows unique electrochemical behavior unlike typical suppressors or levelers.…”

mentioning

confidence: 99%

“…[18][19][20][21][22][23][24][25][26] TU has been used as an additive either solely or in combination with Cl − (TU-Cl − ) in baths used for electrodeposition processes involving various current/potential waveforms such as direct current, pulse-, or pulsereverse waveforms. 20,21,23,24 Various applications of TU as an additive have been studied, including the formation of the Cu twin, Ag superfilling, and the fabrication of CuS nanowire structures.…”

mentioning

confidence: 99%

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Accuracy Improvement in Cyclic Voltammetry Stripping Analysis of Thiourea Concentration in Copper Plating Baths

Choe

Kim

et al. 2015

J. Electrochem. Soc.

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Cyclic voltammetry stripping (CVS) has been regarded as a powerful tool for monitoring the concentrations of organic additives in plating baths. In this study, the dilution titration (DT) method of CVS was modified to improve the measurement accuracy of thiourea (TU) concentrations in Cu plating baths. The conventional DT-CVS method cannot guarantee high accuracy because the electrochemical behavior of TU is concentration and potential dependent, which can cause disturbances in the response signals. In this study, by adding polyethylene glycol (PEG) as an organic additive, the undesirable electrochemical behavior of TU was suppressed and the accuracy of DT-CVS was greatly improved. Using the improved method, the concentrations of TU and its derivatives in the plating bath were measured. The errors between the real and measured concentrations were reduced from 15.0%, 36.0%, and 15.0% using the conventional DT-CVS method to within 3.00%, 6.00%, and 6.00% for TU, N-ethyl thiourea, and N ,N-diethyl thiourea, respectively, using the improved method. Organic additives are important constituents of the electroplating baths owing to their ability to control the morphology and the film properties of the plated material.1-17 The organic additives are typically grouped into suppressors, accelerators, and levelers, based on their roles and functionality.1-17 Examples of organic additives in electroplating baths include bis(3-sulfopropyl) disulfide, polyethylene glycol (PEG), janus green b (JGB), polyethylene imine (PEI), 1,2,3-benzotriazole (BTA), and thiourea (TU). 1,2,[6][7][8][9][10][11][12][13][18][19][20][21][22][23][24][25][26][27][28][29] TU is a common additive in Cu and Ag electrodeposition baths and induces leveling and grain refining properties.18-26 TU has been used as an additive either solely or in combination with Cl − (TU-Cl − ) in baths used for electrodeposition processes involving various current/potential waveforms such as direct current, pulse-, or pulsereverse waveforms. 20,21,23,24 Various applications of TU as an additive have been studied, including the formation of the Cu twin, Ag superfilling, and the fabrication of CuS nanowire structures. 18,19,[23][24][25][26] TU is known to form thiolate complexes such as [Cu-(TU) ions. [27][28][29] Owing to the various derivatives and their different electrochemical responses, TU shows unique electrochemical behavior unlike typical suppressors or levelers. Although TU commonly reduces the Cu deposition rate, it often acts in an opposite role as an accelerator under specific conditions such as low concentrations and low overpotentials. [27][28][29] Several mechanisms explaining the accelerating effect of TU have been proposed. [27][28][29] Generally, the reduction of Cu 2+ occurs in two steps, namely the reduction of Cu 2+ to Cu + , followed by the reduction of Cu + to Cu 0 . The first step has been known to be the rate-determining step. In the presence of TU, however, additional reactions occur, as described in Eq. 1. 29 They explained that the chain reaction...

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One-step template-free electrosynthesis of 300μm long copper sulfide nanowires

Cited by 25 publications

References 15 publications

Covellite CuS – Single crystal growth by chemical vapour transport (CVT) technique and characterization

Covellite CuS – Single crystal growth by chemical vapour transport (CVT) technique and characterization

CuS nanostructures prepared by a hydrothermal method

Accuracy Improvement in Cyclic Voltammetry Stripping Analysis of Thiourea Concentration in Copper Plating Baths

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