Open access to technology platforms for InP-based photonic integrated circuits

Lawniczuk, K Katarzyna; Augustin, LM Luc; Grote, N.; Wale, M.J.; Smit, M.K.; Williams, Kevin

doi:10.1515/aot-2015-0012

Cited by 11 publications

(5 citation statements)

References 22 publications

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“…Figure 3 illustrates the block diagram of our PIC chip, conceptualized using Smart Photonics technology [11,12,13,14]. The chip integrates four distributed Bragg reflector (DBR) lasers with three electrodes that interface with the gain section.…”

Section: Design and Fabricationmentioning

confidence: 99%

Photonic Integrated Circuits with an Optical Phased Array for THz Generating and Beamforming

Ming

2024

Preprint

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Photonic integrated circuits (PICs) are crucial in terahertz (THz) technology due to their compact, integrated, efficient, and controllable design. They consolidate multiple active or passive components on a single chip, facilitating lightweight construction and high-speed communication, imaging, and sensing applications. The generic foundry platform using indium phosphide (InP) offers a universal integration platform for THz systems. Optical arrays for THz beamforming can precisely adjust the beam length and integrate both passive and active components, enhancing the THz beamforming performance. Indium phosphide-based photonic integrated circuits (PICs) offer an ideal solution for achieving precise, high-speed, compact, and integrated terahertz (THz) beamforming, addressing a broad spectrum of application needs. This study employs an InPbased multi-project wafer (MPW) platform for designing a 4-channel optical phase array (OPA) aimed at THz beamforming. The platform offers a range of validated optical components that can be utilized to construct intricate circuits, thereby enhancing the reliability of the system implementation. Moreover, the hybrid integration technology developed by Smart Photonics and Fraunhofer HHI allows for quick prototyping, short iteration cycles, and reduced development time and costs.

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Section: Design and Fabricationmentioning

confidence: 99%

Photonic Integrated Circuits with an Optical Phased Array for THz Generating and Beamforming

Ming

2024

Preprint

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“…Different materials are suitable to produce PICs, nonetheless, only a few have been selected by actors in the ecosystem and, therefore, have gained traction into foundries, software suppliers, design houses, and fabless companies [48]. Current main photonic integration platform technologies offering access to generic processes and manufacturing through multi-project wafer (MPW) runs are silicon (Si) [49,50], indium phosphide (InP) [51][52][53], and silicon nitride (SiN) [48,54]. The selection of the integrated photonic platform to realize PICs is driven by the functional requirements of the devices to be developed and the underlying available components (active/passive) for the different platforms [33,55,56].…”

Section: Pic Evolutionmentioning

confidence: 99%

Photonic Integrated Circuits for NGPON2 ONU Transceivers (Invited)

et al. 2020

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The development of photonic integrated circuits (PIC) for access network applications, such as passive optical networks (PON), constitutes a very attractive ecosystem due to PON’s potential mass market. The implementation of PIC solutions in this context is expected to facilitate the possibility of increasing the complexity and functionalities of devices at a potentially lower cost. We present a review addressing the prominent access network market requirements and the main restrictions stemming from its specific field of application. Higher focus is given to PON devices for the optical network unit (ONU) and the implications of designing a device ready for market by discussing its various perspectives in terms of technology and cost. The discussed PIC solutions/approaches in this paper are mainly based on indium phosphide (InP) technology, due to its monolithic integration capabilities. A comprehensive set of guidelines considering the current technology limitations, benefits, and processes are presented. Additionally, key current approaches and efforts are analyzed for PON next generations, such as next-generation PON 2 (NGPON2) and high-speed PON (HSP).

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“…The current demand for flexibility and re-configurability into telecommunications networks claims enhanced functionality of photonic integrated circuits (PICs) for optical communications [1,2]. Indium phosphide (InP) [3,4] and silicon-based [5,6] platforms are among the most commonly used to realise PIC. InP PIC offers solutions for high-speed computing and data transmission due to excellent electro-optical properties [7].…”

Section: Introductionmentioning

confidence: 99%

“…InP PIC offers solutions for high-speed computing and data transmission due to excellent electro-optical properties [7]. Thus, it allows efficient light generation and detection, light guiding and fast phase modulation, allowing built-in active components such as lasers and optical amplifiers [4,8].…”

Section: Introductionmentioning

confidence: 99%