Open foundry platform for high-performance electronic-photonic integration

Orcutt, Jason S.; Moss, Benjamin; Sun, Chen; Leu, Jonathan; Georgas, Michael; Shainline, Jeffrey M.; Zgraggen, Eugen; Li, Hanqing; Sun, Jie; Weaver, Matthew; Urošević, Stevan; Popović, Miloš A.; Ram, Rajeev J.; Stojanović, Vladimir

doi:10.1364/oe.20.012222

Cited by 205 publications

(133 citation statements)

References 29 publications

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“…As an indirect semiconductor, silicon is not suitable as a material for light sources and therefore III-V/Si hybrid integration has been successfully developed to solve this problem [5]. Recently, much effort has been devoted to the integration of photonic and electronic circuits on the same chip [6].…”

Section: Introductionmentioning

confidence: 99%

Silicon photonic devices and platforms for the mid-infrared

Nedeljkovic¹,

Khokhar²,

Hu³

et al. 2013

Opt. Mater. Express

118

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Due to its excellent electronic and photonic properties, silicon is a good candidate for mid-infrared optoelectronic devices and systems that can be used in a host of applications. In this paper we review some of the results reported recently, and we also present several new results on midinfrared photonic devices including Mach-Zehnder interferometers, multimode interference splitters and multiplexers based on silicon-oninsulator, polysilicon, suspended silicon, and slot waveguide platforms.

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Section: Introductionmentioning

confidence: 99%

Silicon photonic devices and platforms for the mid-infrared

Nedeljkovic¹,

Khokhar²,

Hu³

et al. 2013

Opt. Mater. Express

118

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“…Reproduced from Ref. [159] CMOS-based electronics and photonics [160,161] for ion control and readout. A largescale, integrated optics architecture might have single-mode waveguides distributing light to various locations in a dielectric layer in the same chip as the trap electrodes, and focusing grating couplers directing the light, through gaps in the trap electrodes to µm-scale focuses at the ion locations.…”

Section: A Quantum System Built With Classical Computer Partsmentioning

confidence: 99%

Technologies for trapped-ion quantum information systems

Eltony

Gangloff

Shi

et al. 2016

Quantum Inf Process

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Scaling up from prototype systems to dense arrays of ions on chip, or vast networks of ions connected by photonic channels, will require developing entirely new technologies that combine miniaturized ion trapping systems with devices to capture, transmit, and detect light, while refining how ions are confined and controlled. Building a cohesive ion system from such diverse parts involves many challenges, including navigating materials incompatibilities and undesired coupling between elements. Here, we review our recent efforts to create scalable ion systems incorporating unconventional materials such as graphene and indium tin oxide, integrating devices like optical fibers and mirrors, and exploring alternative ion loading and trapping techniques.

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“…This required significant development, and the addition of many layers in order to allow CMOS transistors, modulators, and germanium photodetectors to co-exist. On the other hand, unmodified CMOS or bipolar process integration is, on the surface, attractive from a process development cost perspective [30]. However, a demonstration of high-speed devices has yet to be presented.…”

Section: Electronic-photonic Integrationmentioning

confidence: 99%

Progress in silicon platforms for integrated optics

Novack¹,

Streshinsky²,

Ding

et al. 2014

Nanophotonics

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Rapid progress has been made in recent years repurposing CMOS fabrication tools to build complex photonic circuits. As the field of silicon photonics becomes more mature, foundry processes will be an essential piece of the ecosystem for eliminating process risk and allowing the community to focus on adding value through clever design. Multi-project wafer runs are a useful tool to promote further development by providing inexpensive, low-risk prototyping opportunities to academic and commercial researchers. Compared to dedicated silicon manufacturing runs, multi-project-wafer runs offer cost reductions of 100 × or more. Through OpSIS, we have begun to offer validated device libraries that allow designers to focus on building systems rather than modifying device geometries. The EDA tools that will enable rapid design of such complex systems are under intense development. Progress is also being made in developing practical optical and electronic packaging solutions for the photonic chips, in ways that eliminate or sharply reduce development costs for the user community. This paper will provide a review of the recent developments in silicon photonic foundry offerings with a focus on OpSIS, a multiproject-wafer foundry service offering a silicon photonics platform, including a variety of passive components as well as high-speed modulators and photodetectors, through the Institute of Microelectronics in Singapore.

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Open foundry platform for high-performance electronic-photonic integration

Cited by 205 publications

References 29 publications

Silicon photonic devices and platforms for the mid-infrared

Silicon photonic devices and platforms for the mid-infrared

Technologies for trapped-ion quantum information systems

Progress in silicon platforms for integrated optics

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