A thin solid-film deposition scheme is presented based on electron injection from a planar ballistic cold emitter into a metal-salt solution. Under the emitter operation in CuSO 4 solutions without using any counter electrodes, thin polycrystalline Cu films are uniformly deposited on the emitting area due to the reduction of Cu 2+ ions at the interface. By using the device with patterned emission line windows, a thin Cu nanowire array can be fabricated in parallel. The effect presented here provides an advanced wet processing not only for metallization but also for the deposition of various thin solid films.As reported previously, 1,2 a nanocrystalline silicon ͑nc-Si͒ diode uniformly emits quasi-ballistic electrons in vacuum under a biased condition. The emission mechanism is based on the ballistic electron transport in the nc-Si layer, 3-6 where electrons are accelerated via multitunneling cascade followed by ejection into vacuum through a thin top contact. The mean energy of output electrons reaches 5-7 eV at applied voltages of 15-20 V. This nc-Si ballistic planar emitter has several advantages: ͑i͒ highly energetic and directional emitted electrons; 7 ͑ii͒ compatibility with silicon planar processing at low temperatures; ͑iii͒ relatively low operating voltage; ͑iv͒ insensitivity to vacuum pressure; 8 ͑v͒ quick dynamic response; 9 and ͑vi͒ availability for emitter array fabrication on large-area glass substrate. 10 The nc-Si ballistic emitter has versatile technological potentials in various media such as flat panel display 11 and parallel electronbeam lithography 12 in vacuum, negative ion source in air applicable to the latent image formation, 8 and vacuum-UV light emission by internal excitation of xenon molecules. 13 Another important opportunity is that the nc-Si ballistic emitter operates as an active electrode that supplies strongly reducing electrons into pure water 14 and aqueous solutions. 15 Under its simple operation without using any counter electrodes, hydrogen gas is generated by the reduction of H + ions and/or H 2 O molecules at the emitting area with no by-product such as oxygen. To further confirm the reducing effect of energetic electron injection into the solutions, the nc-Si emitter is driven in metal-salt aqueous solutions. Under the operation in a CuSO 4 solution, thin Cu films are uniformly deposited on the emitting surface. As a novel deposition scheme of thin solid films, this technique is applied to parallel Cu nanowiring.
ExperimentalThe nc-Si ballistic emitter is composed of a thin Au film, an anodized nc-Si layer, a polycrystalline Si ͑poly-Si͒, and an n + -type Si substrate, as shown in Fig. 1. The poly-Si film ͑1.6 m thick͒ was formed on n + -Si wafer by the low pressure chemical vapor deposition. The nc-Si layers were formed by conventional photoanodization in an ethanoic HF solution ͑55% HF: ethanol = 1:1͒ under illumination by a 500 W tungsten lamp from a distance of 20 cm. The anodization current was sequentially modulated at three cycles, at 2.5 mA/cm 2 for 2 s and 25 mA/c...