2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2024
DOI: 10.1109/epeps61853.2024.10754092
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Operator Inference for Rigid-Flex Printed Circuit Boards Subject to Large Deformations

Pascal den Boef,
Diana Manvelyan,
Wil Schilders
et al.
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