This
study reports on the effect of a bilayer period on the growth behavior,
microstructure evolution, and electrical properties of atomic layer
deposition (ALD) deposited In–Zn–O (IZO) films, fixing
the ALD cycle ratio of In–O/Zn–O as 9:1. Here, the bilayer
period is defined as the total number of ALD cycles in one supercycle
of In–O and Zn–O by alternately stacking Zn–O
and In–O layers at a temperature of 220 °C. IZO films
with a bilayer period from 10 to 40 cycles, namely, IZO[In–O/Zn–O
= 9:1] to IZO[36:4], result to form an amorphous phase with a resistivity
of 4.94 × 10–4 Ω·cm. However, by
increasing the bilayer period above 100 cycles, the IZO films begin
to form a mixed amorphous–nanocrystalline microstructure, resulting
from the limited intermixing at the interfaces. Concomitantly, the
overall film resistivity is considerably increased with a simultaneous
decrease in both the carrier mobility and the concentration. These
results not only reveal the importance of the bilayer period in designing
the ALD stacking sequence in the ALD-IZO, but also provide the possibility
of forming various multilayered materials with different electrical
properties.