Optical backplane for board-to-board interconnection based on a glass panel gradient-index multimode waveguide technology

Brusberg, Lars; Schröder, Henning; Pitwon, Richard; Whalley, Simon; Herbst, Christian; Miller, Allen; Neitz, Marcel; Roder, Julia; Lang, Klaus‐Dieter

doi:10.1109/ectc.2013.6575581

Cited by 16 publications

(8 citation statements)

References 3 publications

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“…The propagation loss was measured to be 0.05 dB/cm and coupling loss was 2.15 dB for a 50 μm core graded index multimode (GI MM) fiber launch. The results are comparable with those of previous work [17]. In addition, the waveguides were characterized at a wavelength of 850 nm with propagation loss measured to be 0.41 dB/cm and coupling loss 2.7 dB for a GI MM fiber launch.…”

Section: Waveguide Characterisation Resultssupporting

confidence: 87%

Pluggable Electro-Optical Circuit Board Interconnect Based on Embedded Graded-Index Planar Glass Waveguides

Pitwon

Brusberg

Schröder

et al. 2015

J. Lightwave Technol.

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Widespread adoption of electro-optical circuit boards based on embedded glass waveguide technology would enable seamless optical connectivity from external fiber-optic networks to system embedded optical interconnect architectures. In this paper, we report on the fabrication of planar multimode waveguides within thin glass foils based on a two-step thermal ion exchange process. Novel lamination techniques were developed to allow glass waveguide panels to be reliably integrated into a conventional electronic multilayer printed circuit board. In addition, a complete suite of optical connector technologies were developed to enable both direct fiber-to-board and board-to-board connectivity. We present the design, development, and characterization of a fully integrated connection platform, comprising a 281 × 233 mm 2 multilayer electro-optical backplane with integrated planar glass waveguides, a pluggable connector system, and five pluggable test cards. Both on-card and externally generated 850 and 1310-nm optical test data were conveyed through the connector and waveguide system and characterised for in-system and system-to-system optical connectivity at data rates up to 32 Gb/s per channel exhibiting bit error rates of less than 10 −12 .

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Section: Waveguide Characterisation Resultssupporting

confidence: 87%

Pluggable Electro-Optical Circuit Board Interconnect Based on Embedded Graded-Index Planar Glass Waveguides

Pitwon

Brusberg

Schröder

et al. 2015

J. Lightwave Technol.

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“…The propagation loss was measured to be 0.07 dB/cm and coupling loss was 2.15 dB for a GI MM fiber launch. The results are comparable with those of previous work [5].…”

Section: Electro-optical Backplane Designsupporting

confidence: 95%

“…In previous work [5] the waveguide characteristics were extensively characterized. A typical refractive index profile for multimode waveguides can be seen in Figure 6.…”

Section: Electro-optical Backplane Designmentioning

confidence: 99%

Electro-optical backplane demonstrator with integrated multimode gradient-index thin glass waveguide panel

Schröder¹,

Brusberg

Pitwon³

et al. 2015

SPIE Proceedings

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Optical interconnects for data transmission at board level offer increased energy efficiency, system density, and bandwidth scalability compared to purely copper driven systems. We present recent results on manufacturing of electrooptical printed circuit board (PCB) with integrated planar glass waveguides. The graded index multi-mode waveguides are patterned inside commercially available thin-glass panels by performing a specific ion-exchange process. The glass waveguide panel is embedded within the layer stack-up of a PCB using proven industrial processes. This paper describes the design, manufacture, assembly and characterization of the first electro-optical backplane demonstrator based on integrated planar glass waveguides. The electro-optical backplane in question is created by laminating the glass waveguide panel into a conventional multi-layer electronic printed circuit board stack-up. High precision ferrule mounts are automatically assembled, which will enable MT compliant connectors to be plugged accurately to the embedded waveguide interfaces on the glass panel edges. The demonstration platform comprises a standardized sub-rack chassis and five pluggable test cards each housing optical engines and pluggable optical connectors. The test cards support a variety of different data interfaces and can support data rates of up to 32 Gb/s per channel

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“…A great benefit has also been demonstrated by employing optical fibers from the interconnections even as sensors. 13 This is closely related to the unique features exhibited by fiber optic sensors, such as high sensitivity, electromagnetic immunity, robustness, flexibility, compactness, and multiplexing. In this paper, we propose a very specific packaging for optical microresonators 14 which are a class of resonant structures that offer an additional high degree of compactness and higher sensitivities in comparison to other well-known fiber optic sensors.…”

Section: Long-term Reliabilitymentioning

confidence: 94%

Hybrid photonic system integration using thin glass platform technology

Schröder

Schwietering

Bottger

et al. 2021

J. Optical Microsystems

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Demand for high integration of optoelectronic and micro-optical components into micro-electronic systems for communication, computing, medical, and sensing applications is increasing. Advanced hybrid packaging technologies are used to enhance glass-based substrates featuring electrical, thermal, and optical functionalities with laser diodes, modulators, isolators, photonic integrated circuits (PIC), beam-splitting components, and micro-lenses. Such glassbased substrates can be thin glass layers on large panels or more mini-bench-like boards that can be embedded into organic printed circuit boards (PCBs). Optical fiber interconnects, connectors, and electrical-optical integration platforms are used for higher level system integration and need to be miniaturized on module and board level to fulfill decreasing channel pitch requirements. We provide background on and discuss thin glass as a suitable base material for ion exchanged waveguide panels and interposers, precise glass structuring for posts and holders, the related high precision assembly techniques, and advanced fiber interconnects. Some examples of PCB photonic integration, micro-bench optical sub-assemblies, including PIC, and 3D optical resonator packages that combine most of these approaches will be shown. © The Authors.Published by SPIE under a Creative Commons Attribution 4.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

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Optical backplane for board-to-board interconnection based on a glass panel gradient-index multimode waveguide technology

Cited by 16 publications

References 3 publications

Pluggable Electro-Optical Circuit Board Interconnect Based on Embedded Graded-Index Planar Glass Waveguides

Pluggable Electro-Optical Circuit Board Interconnect Based on Embedded Graded-Index Planar Glass Waveguides

Electro-optical backplane demonstrator with integrated multimode gradient-index thin glass waveguide panel

Hybrid photonic system integration using thin glass platform technology

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