Abstract:Critical dimension (CD) uniformity has recently become increasing essential with miniaturization in semiconductor production. For high-volume manufacturing, high-speed in-wafer uniformity inspection is inevitable. The conventional optical critical dimension (OCD) spectroscopy has low resolution issue because of the large spot size. Consequently, line-scan hyperspectral imaging (LSHI) is presented by Samsung Electronics in 2022. Compared with the OCD, the LSHI has advantages of high throughput, high spatial and… Show more
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