Physical Assurance 2012
DOI: 10.1007/978-3-030-62609-9_6
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Optical Inspection and Attacks

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Cited by 3 publications
(1 citation statement)
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“…Microblast testing is used to determine if markings or scratches on reused or fake components have been intentionally erased using a dry sandblasting method. In contrast, internal assessments necessitate decapping the component to expose its internal structure, which can then be subjected to techniques like optical inspection [56][57][58], wire pull and die/ball shear [59][60][61]. Essential details about die markings, such as the company emblem, manufacturing date, chip identification, and origin country, among others, should be recorded.…”
Section: Physical Inspectionsmentioning
confidence: 99%
“…Microblast testing is used to determine if markings or scratches on reused or fake components have been intentionally erased using a dry sandblasting method. In contrast, internal assessments necessitate decapping the component to expose its internal structure, which can then be subjected to techniques like optical inspection [56][57][58], wire pull and die/ball shear [59][60][61]. Essential details about die markings, such as the company emblem, manufacturing date, chip identification, and origin country, among others, should be recorded.…”
Section: Physical Inspectionsmentioning
confidence: 99%