Optical interconnection between III&amp;#x2013;V chips on Si by using photonic wire bonding

Gu, Zhichen; Amemiya, Tomohiro; Ishikawa, Atsushi; Hiratani, Takuo; Suzuki, Jun–ichi; Nishiyama, Nobuhiko; Tanaka, Takuo; Arai, Shigehisa

doi:10.1109/oic.2015.7115715

2015 IEEE Optical Interconnects Conference (OI) 2015

DOI: 10.1109/oic.2015.7115715

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Optical interconnection between III–V chips on Si by using photonic wire bonding

Zhichen Gu

Tomohiro Amemiya

Atsushi Ishikawa

et al.

Abstract: We connected two III-V laser and photodiode chips on Si substrate by using three-dimensional polymeric wires based on two-photon polymerization. We achieved an enhancement of the transmitting efficiency through PWB compare to the free-space transmission.

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Optical interconnection between III–V chips on Si by using photonic wire bonding

Abstract: We connected two III-V laser and photodiode chips on Si substrate by using three-dimensional polymeric wires based on two-photon polymerization. We achieved an enhancement of the transmitting efficiency through PWB compare to the free-space transmission.

Cited by 0 publications

References 6 publications

No citations

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