Optical lithography with and without NGL for single-digit nanometer nodes

Lin, Burn J.

doi:10.1117/12.2087008

Cited by 7 publications

(2 citation statements)

References 2 publications

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“…Most remarkably, there have been substantial developments to exposure throughput, reliability, variance control and patterning materials for the high resolution required [8,9]. Currently, EUVL is projected to use in manufacturing at the 7-nm node or beyond [10]. ASML, a leading company involved in the development of EUVL tools, revealed that more than 1000 wafers per day had been exposed on its NXE:3300B EUV system over multiple weeks' duration [8].…”

Section: Status and Challengesmentioning

confidence: 99%

Promising Lithography Techniques for Next-Generation Logic Devices

2018

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Continuous rapid shrinking of feature size made the authorities to seek alternative patterning methods as the conventional photolithography comes with its intrinsic resolution limit. In this regard, some promising techniques have been proposed as next-generation lithography (NGL) that has the potentials to achieve both high-volume production and very high resolution. This article reviews the promising NGL techniques and introduces the challenges and a perspective on future directions of the NGL techniques. Extreme ultraviolet lithography (EUVL) is considered as the main candidate for sub-10-nm manufacturing, and it could potentially meet the current requirements of the industry. Remarkable progress in EUVL has been made and the tools will be available for commercial operation soon. Maskless lithography techniques are used for patterning in R&D, mask/mold fabrication and low-volume chip design. Directed self-assembly has already been realized in laboratory and further effort will be needed to make it as NGL solution. Nanoimprint lithography has emerged attractively due to its simple process steps, high throughput, high resolution and low cost and become one of the commercial platforms for nanofabrication. However, a number of challenging issues are waiting ahead, and further technological progresses are required to make the techniques significant and reliable to meet the current demand. Finally, a comparative study is presented among these techniques.

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Section: Status and Challengesmentioning

confidence: 99%

Promising Lithography Techniques for Next-Generation Logic Devices

2018

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“…Most remarkably, there have been substantial developments to exposure throughput, reliability, variance control and patterning materials for the high resolution required [6][7]. Currently, EUVL is projected to use in manufacturing at the 7 nm node or beyond [8]. ASML, a leading company involved in the development of EUVL tools, revealed that more than 15,000 wafers had been exposed on its NXE:3300B EUV system in four weeks' duration [9].…”

Section: Extreme Ultraviolet Lithographymentioning

confidence: 99%

Nanolithography: Status and challenges

Hasan

Luo

2017

2017 23rd International Conference on Automation and Computing (ICAC)

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Abstract-With the help of immersion lithography and multiple patterning, photolithography has been the key technology over the last decade in manufacturing of ICs, microchips and MEMS devices. Continuous rapid shrinking of feature size made the authorities to seek alternative patterning methods that can go beyond classic photographic limits. Some promising techniques have been proposed as next generation lithography and further technological progress are required to make them significant and reliable to meet the current demand. EUVL is considered as the main candidate for sub-10 nm manufacturing because of its process simplicity and reduced operating cost. Remarkable progress in EUVL has been made and the tools will be available for commercial operation soon. EBL, FIB and Xray lithography are used for patterning in R&D, mask/mold fabrication and low volume chip design. DSA have already been realized in lab and further effort will be needed to make it as NGL solution. NIL has emerged attractively due to its simple process-steps, high-throughput, high-resolution and low cost and become one of the commercial platforms for nanofabrication.

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