“…Figure 4a-d highlights the narrow scan of Si 2p, O 1s, N 1s, and C 1s core levels for the SiO x N y films deposited at the substrate temperatures of 70 and 120 • C. In Figure 4a, the peak of the Si 2p core level for the SiO x N y films deposited at 70 • C was located at 103.8 eV, while that of the film deposited at 120 • C shifted to 103.5 eV, which corresponded well to the Si-O-Si chemical bond in the SiO x matrix [22,23]. The shift of the Si 2p peak toward a higher binding energy for the SiO x N y films deposited at 70 • C was attributed to the signal that emerged from the Si atoms, which was surrounded by the undissociated oxygen molecule (i.e., oxygen-rich condition) [24,25]. Moreover, the additive area at the lower binding energy for the SiO x N y films deposited at 120 • C could be ascribed to the existence of the N-Si-O bond originating from the nitrogen atom in substitution for the oxygen atom in the O-Si-O networks, since the peak of the Si 3 N 4 was known to be in the low binding energy of 101.6-102.1 eV [26][27][28].…”