2017
DOI: 10.1016/j.matlet.2016.11.076
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Optimal condition for fabricating superhydrophobic copper surfaces with controlled oxidation and modification processes

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Cited by 18 publications
(3 citation statements)
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“…Superhydrophobic surfaces generally have two main characteristics, hierarchical micro/nanostructure and low surface energy [ 13 , 14 ], which determine the good or bad material wettability [ 15 ]. The preparation processes include etching [ 16 ], immersion [ 17 ], deposition [ 18 ], sol-gel [ 19 ], spraying [ 20 ], and so on.…”
Section: Introductionmentioning
confidence: 99%
“…Superhydrophobic surfaces generally have two main characteristics, hierarchical micro/nanostructure and low surface energy [ 13 , 14 ], which determine the good or bad material wettability [ 15 ]. The preparation processes include etching [ 16 ], immersion [ 17 ], deposition [ 18 ], sol-gel [ 19 ], spraying [ 20 ], and so on.…”
Section: Introductionmentioning
confidence: 99%
“…In addition, due to the thin and uniform self-assembled monolayer (SAM) film, it is often used as a model surface in research applications, 30 which can be designed as a material surface with different properties according to the experimental requirements, so 1-octadecanethiol (ODT) are often adsorbed on the surface of copper substrates to form self-assembled monolayers used in superhydrophobic materials. Talesh Bahrami 31 et al first oxidized the copper mesh with alkali solution and then modified it with a 1-octadecanethiol solution to prepare a self-assembled monolayer on the surface of the copper mesh. However, strong bases are often harmful to the environment.…”
Section: Introductionmentioning
confidence: 99%
“…Preparation of superhydrophobic copper surfaces has been reported in numerous papers by utilizing several techniques such as nanotextured surfaces by using laser beam machining [14] and nanocoatings by employing hydrothermal methods to fabricate CuO film on copper substrate [15]. Several chemical etching and hydrothermal methods, electrodeposition techniques and solution (wet) chemical reaction were also employed such as potentiostatic electrolysis in an ethanolic solution of tetradecanoic acid [16], oxidation in alkaline solutions [17], etching in ammonia solution combined with hydrothermal creation of copper oxide film [18], hydrothermal creation of superhydrophobic Cu 2 S film [19], electrolysis in capsaicin ethanolic solution [20], electrodeposition in myristic acid solution [21], chemical etching in an ammonia solution and consequent calcination in air [22], fabrication of multiscale textured surfaces on copper via electrodeposition in CuSO 4 and H 2 SO 4 [23], an electrochemical modification process in an ethanolic stearic acid solution [24] and electrodeposition to develop multifunctional zinc/polydopamine composite hydrophobic coatings [25].…”
Section: Introductionmentioning
confidence: 99%