Optimal conditions for the wetting balance test

Martorano, K.M.; Martorano, Marcelo Aquino; Brandi, Sérgio Duarte

doi:10.1016/j.jmatprotec.2008.07.015

Cited by 13 publications

(6 citation statements)

References 16 publications

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“…For this reason, they recommended the use of contact angles for comparison purposes. Martorano et al (2009) stated that with the WB method, it was essential to conduct the measurement at a temperature sufficiently higher than the solder's melting point. Otherwise, the wetting curves were disturbed and the results were unreliable.…”

Section: Discussionmentioning

confidence: 99%

Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders

Moser

Fima

Bukat

et al. 2011

Soldering &Amp; Surface Mount Technology

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Purpose -The purpose of this paper is to investigate the influence of In additions on the wetting properties of the Sn2.86Ag0.40Cu (in wt%) eutecticbased alloys, on a copper substrate, in the presence of a flux. The main goal was to find correlations between the results of the wetting balance (WB) and the sessile drop (SD) method, in relation to the contact angles. Design/methodology/approach -The WB method was applied for the wetting measurements, at 2508C, in an air atmosphere and in the presence of a flux. The SD measurements were conducted at the same temperature, in the presence of the same flux, but in an Ar atmosphere, while the maximum bubble pressure (MBP) and dilatometric measurements were conducted in an Ar þ H 2 atmosphere. The density data from the dilatometric method were used for the determination of the surface tension by means of MBP, and the WB method was used to determine the surface and interfacial tension. Next, the surface tension data from these two methods were compared. The WB data were used to calculate the contact angles and the obtained indirect data were compared with the results of the direct SD measurements of the contact angle. Findings -A higher In content in the alloy resulted in a lower contact angle on the copper, and the WB results agreed well with the results of the SD experiments. It was confirmed that, in liquid In-Sn and the alloys containing In and Sn (Ag-In-Sn, Sn-Ag-Cu-In, Sn-Zn-In), the improvement of the wettability was indicated only by the increase of the contact angle with the increasing In content. Research limitations/implications -Further studies are necessary for the confirmation of practical application, but they should be directed to the soldering of high indium alloys on printed circuit boards, with different finishes and qualities of the solder joint performance. Practical implications -Taking into account the contact angle data from the WB and SD methods, the best results of the SAC-In alloy on copper were obtained for the alloy of the highest In content. It was found that the contact angles from SD after 4 s were higher (non-equilibrium conditions) than the values calculated from WB after 3 s. In contrast, the contact angles from SD after 10 min (equilibrium conditions) were lower than those from WB after 3 s. The comparison suggests that the contact angles from WB are situated within the data from SD, showing the same lowering tendency with the increasing content of In, and they may be well accepted for practical purposes. On the other hand, the sample of the solder in the SD method, after a prolonged time -in order to get the equilibrium contact angle -may be used to study the interfacial phenomena with the Cu substrate. The differential thermal analysis results indicate that the melting temperature decreases with increasing tin concentration. Taking into account the results of this study and the available literature data, alloys containing 8-10 wt% of In can be recommended for practical application. Originality/value -The WB and SD methods were used fo...

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Section: Discussionmentioning

confidence: 99%

Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders

Moser

Fima

Bukat

et al. 2011

Soldering &Amp; Surface Mount Technology

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“…Martorano et al (2009) reported that, when the wetting curve shows a long plateau (wetting delay) or a series of shorts plateaus (distortion in wetting curve), the wetting parameters (i.e. wetting time and maximum wetting force) may not convey the desired information.…”

Section: Resultsmentioning

confidence: 99%

Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and Ge

Nobari

Maalekian

Seelig

et al. 2016

SSMT

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Purpose The purpose of this paper is to investigate the effect of Sb (0, 0.2 and 2 wt.%) on wetting performance of lead-free solder of near eutectic Sn-Cu micro-alloyed with Ni and Ge. Design/methodology/approach The melting characteristic of the lead-free alloys was studied using differential scanning calorimetry. Wettability was examined using wetting balance test for two liquid fluxes, water based and alcohol based in two temperatures 265°C and 277°C. Also, contact angle was measured using sessile drop test. Findings It is shown that 0.2 wt.% Sb reduces the melting temperature and pasty range. Moreover, the addition of 0.2 wt.% Sb improves wetting behavior for alcohol-based flux. It is also demonstrated that the effect of Sb on meniscus height in wetting balance test and contact angle in sessile drop test follows the trend of wetting performance. Originality/value It is found that adding 0.2 wt.% Sb improves the wettability of Ni-Ge micro-alloyed Sn-Cu solder; however, higher concentration of Sb does not benefit the alloy.

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“…Figure 1 shows the typical wetting curve from the wetting balance test reflecting the wetting force as a function of the immersed time. During the wetting process, the wetting balance is commonly dominated by the surface tensions among the flux, molten solder and Cu sheet with the Young-Dupre equation [28]: During the wetting process, the wetting balance is commonly dominated by the surface tensions among the flux, molten solder and Cu sheet with the Young-Dupre equation [28]: where θ is the instantaneous contact angle, γ LF , γ SF and γ SL are the surface tensions between flux and liquid solder, between solid Cu and flux and between solid Cu and liquid solder, respectively. Moreover, the wetting force (F) during wetting balance test is expressed as follows [28]:…”

Section: Wettabilitymentioning

confidence: 99%

“…where θ is the instantaneous contact angle, γLF, γSF and γSL are the surface tensions between flux and liquid solder, between solid Cu and flux and between solid Cu and liquid solder, respectively. Moreover, the wetting force (F) during wetting balance test is expressed as follows [28]:…”

Section: Wettabilitymentioning

confidence: 99%

Comprehensive Properties of a Novel Quaternary Sn-Bi-Sb-Ag Solder: Wettability, Interfacial Structure and Mechanical Properties

Wang

Huang

et al. 2019

Metals

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Sn-58Bi eutectic solder is the most recommended low temperature Pb-free solder but is also limited from the interfacial embrittlement of Bi segregation. Since the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides a similar melting point as Sn-58Bi eutectic, this paper systematically investigated the properties of this solder from wettability, bulk tensile properties, interfacial microstructure in solder joints with a Cu substrate, interfacial evolution in joints during isothermal aging and the shear strength on ball solder joints with effect of aging conditions. The results were also compared with Sn-58Bi solder. The wettability of solder alloys was evaluated with wetting balance testing, and the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a better wettability than Sn-58Bi solder on the wetting time. Tensile tests on bulk solder alloys indicated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a higher tensile strength and similar elongation compared with Sn-58Bi solder due to the finely distributed SnSb and Ag 3 Sn intermetallics in the solder matrix. The tensile strength of solder decreased with a decrease in the strain rate and with an increase in temperature, while the elongation of solder was independent of the temperature and strain rate. When soldering with a Cu substrate, a thin Cu 6 Sn 5 intermetallic compound (IMC) is produced at the interface in the solder joint. Measurement on IMC thickness showed that the quaternary Sn-38Bi-1.5Sb-0.7Ag had a lower IMC growth rate during the following isothermal aging. Ball shear test on solder joints illustrated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints had higher shear strength than Sn-58Bi solder joints. Compared with the serious deterioration on shear strength of Sn-58Bi joints from isothermal aging, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints presented a superior high temperature stability. Therefore, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides better performances and the possibility to replace Sn-58Bi solder to realize low temperature soldering.Metals 2019, 9, 791 2 of 12 usually above 245 • C, promotes thermal warpage on a PCB and thinner components [3]. Therefore, the development of low temperature solder provides a lower processing temperature, and therefore reduces the thermal damage caused from using high-temperature solders. Currently, the developed low-temperature solders are mainly selected from the Sn-Bi, Sn-In or Sn-Zn series [4]; but Sn-Bi solder provides the most potential due to its low cost and better comprehensive properties [5].The Sn-Bi binary solder system can reach the low eutectic temperature at 138 • C with a composition of Sn-58Bi, which provides the ideal processing temperature. However, there still exists some serious concerns on the application of Sn-58Bi eutectic solder, such as the interfacial embrittlement in solder joints [6][7][8][9], poorer drop reliability [10], the deterioration on joint strength after aging service [11], etc. All these problems are mainly attributed to the inherent embrittlement of Bi atoms....

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Optimal conditions for the wetting balance test

Cited by 13 publications

References 16 publications

Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders

Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders

Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and Ge

Comprehensive Properties of a Novel Quaternary Sn-Bi-Sb-Ag Solder: Wettability, Interfacial Structure and Mechanical Properties

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