Optimal Control of Traction Motor Drives Under Electrothermal Constraints

Lemmens, Joris; Vanassche, Piet; Driesen, Johan

doi:10.1109/jestpe.2014.2299765

Cited by 128 publications

(61 citation statements)

References 34 publications

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“…Switching frequency hysteresis control is one method of loss reduction, the switching frequency is reduced to limit the junction temperature, in addition the load current is limited to prevent the junction temperature overheating [98]- [101]. In [102], a new approach for junction temperature estimation is investigated using an enhanced-Luenberger-style closed-loop observer.…”

Section: ) Switching Frequency and Current Limitmentioning

confidence: 99%

Review of Power Semiconductor Device Reliability for Power Converters

et al. 2017

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Section: ) Switching Frequency and Current Limitmentioning

confidence: 99%

Review of Power Semiconductor Device Reliability for Power Converters

et al. 2017

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“…The levels reach from system control down to the gate driver. On the layer of the current control a variation of the current limit [31], circulating current among parallel connected converters [32] and circulating reactive power [33] have been applied to control the junction temperature. On the layer of the modulator a selection of the switching frequency [34] and the modulation method [35] have been applied.…”

Section: E Active Thermal Control Of Igbt Modulesmentioning

confidence: 99%

Active methods to improve reliability in power electronics

Falck

Andresen

Liserre

2017

IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society

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Abstract-Reliability of power electronics is a critical issue, as most of the electrical energy is processed by power electronics. Various stressors impact the safe operation of the systems, including harsh environments, temperature variations, humidity, vibration and radiation. Physics of failure analysis uses models that describe how failure mechanisms evolve over time and induce failures. Active methods help to increase the reliability during operation. These methods rely on intelligent control that help to avoid operation conditions that affect stress that lead to failures. This paper provides an overview on recent active methods to increase the reliability of power electronics and categorizes them according to their impact on reliability, invasiveness to system operation and open research opportunities. An industry perspective taken from a survey in the end of 2016 is included to rate how promising the different methods are considered.

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“…Power electronics are employed in a multitude of applications, including grid feeding converters for renewable energy sources [1], inverters for electric vehicles and motor drives in industrial processes [2]. Reliability of power electronics is becoming an increasingly important factor in the system design [3], [4].…”

Section: Introductionmentioning

confidence: 99%

“…Only few active thermal control approaches have been proposed so far. Chosen control parameters are the switching frequency [2], [14], the modulation method [15], the dc link voltage [16], the gate voltage [17] or circulating reactive power [18]. As an example, a shortterm temperature drop can be prevented or reduced when losses are increased temporary by increasing the switching frequency.…”

Section: Introductionmentioning

confidence: 99%

“…Active thermal control can be performed without knowledge of the junction temperature [19]. Also, an electrothermal model can be used to achieve online estimations of the junction temperatures on the basis of electrical measurements to enable more precise control of the thermal stress [2]. This paper achieves a reduced thermal stress without interfering the system operation such as preventing switching operations and thus adding current ripple [15] or limiting the maximal power [14].…”

Section: Introductionmentioning

confidence: 99%

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Active thermal control of IGBT power electronic converters

Falck

Andresen

Liserre

2015

IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society

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Abstract-Thermal cycling is one of the main sources of aging and failures in power electronics. A possibility to reduce the stress to semiconductors is to control the amount of losses that occur in the device during operation. This work presents an active thermal controller that aims at reducing the junction temperature variations in the case of variable power profile. The switching frequency of the converter is the parameter that is affected by the active thermal control, while the operation of the converter remains unchanged. The novelty of the approach is that the switching frequency variation is exploited to prevent excessive cooling down of the semiconductor during a power reduction. A thermal model is used to estimate the losses, so the prior knowledge of the mission profile is not needed. The results of the proposed solution are validated with an experimental prototype and a wide-bandwidth temperature measurement system directly applied to the semiconductor chip. Finally, the impacts of the controller on the module's lifetime is estimated.

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Optimal Control of Traction Motor Drives Under Electrothermal Constraints

Cited by 128 publications

References 34 publications

Review of Power Semiconductor Device Reliability for Power Converters

Review of Power Semiconductor Device Reliability for Power Converters

Active methods to improve reliability in power electronics

Active thermal control of IGBT power electronic converters

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