Optimal design of package structure of the hybrid integrated DC/DC power module based on orthogonal experimental method

Abstract

The hybrid integrated DC/DC power modules are being used in many field, however, the operating temperature of the components becomes higher with the increasing density of the power module assembly. In this paper, orthogonal experimental design method is used to study the variation trend of DC/DC power module package thermal performance with combination of different package structure material and parameters, thus determining primary and secondary order of factor which has an influence on package heat dissipation and obtaining optimum combination of package structure parameters. The results of finite element simulation analysis shows that adopting the optimum combination of package structure parameters can decrease the chip's junction temperature.

Heat Dissipation Capability of Stagger-Stacked Double Data Rate Module

“…The L16 (45) orthogonal array is chosen as the main experiment to minimize the junction temperature. The junction temperature of the module is used as the quality factor [15]. The orthogonal test combination and simulation results are listed in Table 3.…”