2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium 2011
DOI: 10.1109/stherm.2011.5767175
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Optimal heat transfer performance of the microfluidic electrospray cooling devices

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Cited by 9 publications
(2 citation statements)
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“…Wang and Mamishev [10] investigated the average heat transfer of enclosed electrospraying chambers for three different geometry types in the multi-jet regime. They achieved a maximum average heat transfer enhancement of 1.87 fold over natural convection (NC) for their 8 source, 5 mm pitch array at the lowest wall heat flux of 4,384 W m −2 .…”
Section: Spray Plumementioning
confidence: 99%
“…Wang and Mamishev [10] investigated the average heat transfer of enclosed electrospraying chambers for three different geometry types in the multi-jet regime. They achieved a maximum average heat transfer enhancement of 1.87 fold over natural convection (NC) for their 8 source, 5 mm pitch array at the lowest wall heat flux of 4,384 W m −2 .…”
Section: Spray Plumementioning
confidence: 99%
“…Wang and Mamishev [56] investigated the average heat transfer of enclosed electrospraying chambers for three different geometry types in the multi-jet regime. They achieved a maximum average heat transfer enhancement of 1.87 fold over natural convection (NC) for their 8 source, 5 mm pitch array at the lowest wall heat flux of 4,384 W m −2 .…”
Section: Introductionmentioning
confidence: 99%