Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method

Tsai, Jinn-Tsong; Chang, Chiung Wen; Chen, Wen-Ping; Chou, Jyh–Horng

doi:10.1109/access.2016.2581258

Cited by 21 publications

(6 citation statements)

References 46 publications

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“…Figure 5 illustrates the bonding machine parameters as input factors to increase the bonding yield in the study. According to the literature on parameter optimization for the bonding process for IC assembly and the expert knowledge of engineers, four adjustable factors were considered influential in improving the bounding quality in this study (Su and Yeh 2011;Tsai 2014;Tsai et al 2016;Lin and Lin 2020). These four control factors are bond power (A), bond time (B), bond force (C), and bond temperature (D), as shown in Table 3.…”

Section: Methodsmentioning

confidence: 99%

Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach

Chiu

Wang

2022

Int J Adv Manuf Technol

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Wire bonding is key to high-quality IC assembly in semiconductor packaging. An electrical test was conducted before wire bonding. During the electrical test, the needle probes touched the surface of each bond pad resulting in a probe trace left, called probe marks. The probe mark on the bond pad affects the adhesion between the bond pad and copper ball. Generally, the bond ball can be removed easily under shear testing if the ratio of probe mark area to pad area is greater than 20%. A large probe mark causes a defect in the yield. However, rejecting the orders of wafer batches with large probe marks will result in a loss of market share and good relationships with clients. In order to find the optimal parameter settings for the batches of chips with probe mark areas larger than 20% and deal with multiple response problems, this study aims to optimize the parameters of operation for the IC with large probe marks in the wire bonding process to improve process capability and production yield. Response surface methodology (RSM) optimization with the desirability function approach was introduced into the central composite design to obtain the optimal process parameters efficiently and eliminate defects. The optimal parameter settings for the four factors were determined as follows: 90 mA bond power, 12 ms bond time, 10 g bond force, and 180 °C bond temperature. The validation testing confirms that optimal parameter settings increase yield from 98.84% to 99.94% with good process capability, helping companies improve quality, reduce defect costs, and improve customer relationships.

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Section: Methodsmentioning

confidence: 99%

Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach

Chiu

Wang

2022

Int J Adv Manuf Technol

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“…It is defined differently in different types of experiments. In the semiconductor processing industry, for example, η is a logarithmic function of surface defect density [37], [38]. Expressions for η can generally have many forms and they can obfuscate the clarity of OEM properties.…”

Section: New Theory For Assembly Of a Solid Slot Winding A Orthmentioning

confidence: 99%

Modeling of Insulation Paper Damage in the Assembly of a Solid Slot Winding

Stefe¹,

Jenko

2020

IEEE Access

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Tight assembly of stator windings with no insulation paper damage is a manufacturing challenge. We evaluate different sets of parts according to the following parameters: magnet wire thickness, stator slot smoothness, length of the straight magnet wire after the slot end, and type and amount of insulation cap at the end of the slot. These parameters have discrete values with small differences between them. The damage criterion is the decrease of the insulation paper breakdown voltage after assembly/disassembly of parts, assembled in a small set of designed experiments. Parameter values, i.e., levels at individual experiments are set by an orthogonal experiment matrix. Repetition of each experiment provides statistical significance. Data analysis shows that the additive model alone is not sufficient due to the high correlation of the parameters' influences. We extend the model to include interparameter influences, which we model by adding a virtual parameter. The extended additive model generates parameter values that do not degrade the insulation paper breakdown voltage within the manufacturing process. These values are verified by repetitions of the control experiment. INDEX TERMS Analysis of variance, breakdown voltage, design for experiments, design for manufacture, dielectrics and electrical insulation, extended additive model, insulation paper damage, insulation testing, interparameter influence, in-wheel motor reliability, matrices, metal-insulator structures, orthogonal matrix experiments, permanent magnet motors, stators.

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“…This paper presents a novel optimisation method called FITM [17,[22][23][24][25]. The advantages of FITM compared with Taguchi method [19] can be concluded as follows: (i) the FITM is the enhanced method of Taguchi method, which can involve all the advantages of Taguchi method particularly the high computation efficiency advantage.…”

Section: Proposed Fitmmentioning

confidence: 99%

“…This paper presents a novel design optimisation approach-fuzzy inference Taguchi method (FITM) [20][21][22][23][24][25] to solve the multiobjective optimisation of PMSLM. First, five fatal structure factors and their levels were selected according to the design principle of PMSLM.…”

Section: Introductionmentioning

confidence: 99%

Multi‐objective design optimisation for PMSLM by FITM

Dong

Song

Zhao

et al. 2018

IET Electric Power Applications

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This study researches the multi-objective design optimisation of permanent magnet linear synchronous motors (PMSLMs) which are applied in high-precision laser cutting machines. The innovative fuzzy inference Taguchi method (FITM) coupled with finite element analysis (FEA) is proposed to solve the multi-objective optimisation problems as well as the maximum motor thrust with minimum thrust ripple. On the basis of the orthogonal array established by Taguchi method, the fuzzy inference system was introduced to translate the multiple optimisation targets to a single target. After the optimal selection analysis, the best combination of motor structure factors is obtained with a small FEA computation. Experimental results from the PMSLM prototype can confirm the validity and superiority of FITM.

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Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method

Cited by 21 publications

References 46 publications

Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach

Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach

Modeling of Insulation Paper Damage in the Assembly of a Solid Slot Winding

Multi‐objective design optimisation for PMSLM by FITM

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