Optimising integrated heat spreaders with distributed heat transfer coefficients: A case study for CPU cooling

Elliott, J.W.; Lebon, M.T.; Robinson, A.J.

doi:10.1016/j.csite.2022.102354

Cited by 20 publications

(7 citation statements)

References 30 publications

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“…Individual serpentine lines are patterned resistors, where gray thermal sensors (Rsense) with a total number of 2933 squares are on either side of a red heating resistor (Rheat) with a total number of 800 squares in the center. The Rheat resistor in the center of the design simulates heating circuitry or a CPU operating at high clock rates, which typically generates heat flux densities of 1.12-2.5 W/mm 2 [17]. The temperature sensors were placed at a different distance to experimentally understand the lateral heat dissipation.…”

Section: Device Designmentioning

confidence: 99%

Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration

Huang,

Kiebala,

Suflita

et al. 2024

Electronics

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Advanced electronics technology is moving towards smaller footprints and higher computational power. In order to achieve this, advanced packaging techniques are currently being considered, including organic, glass, and semiconductor-based substrates that allow for 2.5D or 3D integration of chips and devices. Metal-core substrates are a new alternative with similar properties to those of semiconductor-based substrates but with the added benefits of higher flexibility and metal ductility. This work comprehensively compares the thermal properties of a novel metal-based substrate, molybdenum, and silicon and fused silica glass substrates in the context of system-on-foil (SoF) integration. A simple electronic technique is used to simulate the heat generated by a typical CPU and to measure the heat dissipation properties of the substrates. The results indicate that molybdenum and silicon are able to effectively dissipate a continuous power density of 2.3 W/mm2 as the surface temperature only increases by ~15 °C. In contrast, the surface temperature of fused silica glass substrates increases by >140 °C for the same applied power. These simple techniques and measurements were validated with infrared camera measurements as well as through finite element analysis via COMSOL simulation. The results validate the use of molybdenum as an advanced packaging substrate and can be used to characterize new substrates and approaches for advanced packaging.

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Section: Device Designmentioning

confidence: 99%

Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration

Huang,

Kiebala,

Suflita

et al. 2024

Electronics

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“…In this study, the steady k-ɛ Realizable enhancing wall treatment model was used. This is expected to get a good Y+ area so that the viscous sublayer area can be better captured by the simulation [24], [25]. The energy equation is activated to obtain convection and conduction heat transfer in the CPU.…”

Section: Cpu (Central Processing Unit)mentioning

confidence: 99%

“…In the cell zone, the solid processor activates the source term of the market heat generation processor, namely thermal design power (TDP) 65Watt, or if converted to heat generation, it becomes 2.6x106 Watt/m3 from volume processor [25]. Then, the boundary condition inlet uses an inlet velocity of 5 m/s with a hydraulic diameter of 125 mm and a turbulent intensity of 5%.…”

Section: Cpu (Central Processing Unit)mentioning

confidence: 99%

Numerical study optimation design of CPU cooling system analysis using CFD method

Yudanto,

Inderanata,

Johan

et al. 2023

AET

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Computers often experience damage to the CPU, especially the mainboard and processor, due to several factors, including human error or excessive use and environmental conditions. Component placement is frequently utilized to improve the CPU room conditions to keep it cool. This research numerically investigates desktop PC processors and heatsink configurations for mechanical engineering vocational learning. The kind of metal material, number of fans, and fan arrangement were all tested at three levels. The computer components in this research are the CPU, heatsink, fan, and processor—a 65-watt Thermal Design Power (TDP) CPU with a constant air intake speed of 5 m/s. The criteria investigated include metal type (steel, aluminum, and copper), cooling design (horizontal, vertical, and mixed), and fan count (2-4-8). The methods used in this research are the Computational Fluid Dynamics (CFD) method and the Taguchi method to examine fluid flow characteristics and temperature. Numerical results show the maximum temperature is 123 °C in the vertical, eight-fan, and steel configurations. Minimum temperature 39.22 °C in mixed configuration, eight fans, and copper. These findings reveal that the kind of metal material, number of fans, and fan arrangement all impact the CPU cooler and heatsink configuration. However, the Taguchi method can provide a more detailed understanding of configuration.

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“…Additionally, the use of impinging liquid jet arrays can further improve the cooling performance, as this technology has been shown to achieve both very high local and average convective heat transfer coefficients across the impingement surface [3]. It has also been shown that engineered arrays of jets can in theory target areas of high heat flux and leverage the conjugate nature of the heat transfer in the IHS in such a way that optimised deigns can be engineered for specific combinations of the heat source (die) and IHS [4].…”

Section: Introductionmentioning

confidence: 99%

Optimising liquid impingement jet arrays for concentrated heat sources

Elliott,

Byrne,

Robinson

2024

J. Phys.: Conf. Ser.

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This work seeks to investigate jet array impingement liquid cooling of CPU processors that utilise Integrated Heat Spreaders. In this study, single and centralised heat sources of various sizes (10 mm to 20 mm) were investigated, and a series of single and multi-objective optimisation studies were carried out to determine the optimum arrangement of microjets for different heat source sizes based on variable geometric inputs of the jet orifice plate. The results indicated that the design of the optimum jet orifice strongly depends on the size of the heat source as well as whether the target optimisation strategy is to achieve minimum thermal resistance, or both minimum thermal resistance and minimum pumping power simultaneously. A clustering of quite different orifice designs in optimal zones is observed, where approximately the same hydraulic and/or thermal performance is observed.

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Optimising integrated heat spreaders with distributed heat transfer coefficients: A case study for CPU cooling

Cited by 20 publications

References 30 publications

Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration

Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration

Numerical study optimation design of CPU cooling system analysis using CFD method

Optimising liquid impingement jet arrays for concentrated heat sources

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