Optimization of 3D IC stacking chip on molded encapsulation process: a response surface methodology approach

Ishak, M. H. H.; Ismail, Farzad; Aziz, M. S. Abdul; Abdullah, M. Z.; Abas, Aizat

doi:10.1007/s00170-019-03525-4

Cited by 7 publications

(2 citation statements)

References 29 publications

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“…The Response Surface Methodology approach has been preferred and utilized by many scientists [24][25][26][27][28] to optimise various systems. Hence, in this study, Response Surface Methodology was utilized for designing the experiments and developing a model to evaluate the influence of three independent process parameters (A: feed water temperature, B: flow rate, C: vacuum pressure) on the response (R: distillate).…”

Section: Experiments Design Using Rsmmentioning

confidence: 99%

Design, Modelling and Optimization of a Novel Concentrated Solar Powered (CSP) Flash Desalination System Involving Direct Heating and Pressure Modulation Using Response Surface Methodology (RSM)

et al. 2022

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The main problem with existing desalination technologies is that they consume high input energy to generate fresh water. Secondly, this energy demand is usually met by conventional sources of energy such as fossil fuels. With limited conventional energy reserves predicted for the future, the focus is on the utilization of renewable sources of energy such as solar, wind, and geothermal energy for powering desalination systems. Such a transformation would make the desalination systems more energy efficient, sustainable, and economical. In this paper, a novel concentrated solar powered (CSP) flash desalination system with direct heating and pressure modulation is presented. A lab-scale prototype was designed, manufactured, and tested for feed water collected from the Arabian Sea and in climatic conditions of Al-Khobar city in Saudi Arabia. The effect of three process parameters, namely, feed water temperature (30–40 °C), feed water flow rate (0.003–0.006 kg/s), and vacuum pressure (0.1–0.3 bar) on distillate production, was investigated. System modelling and optimization were done using Design Expert software and Response Surface Methodology (RSM). The central composite design technique was employed for the optimization of process parameters. The adequacy of the developed distillate production model was verified by ANOVA. The optimum values of feed water temperature, flow rate, and vacuum pressure are reported to be 40 °C, 0.005 kg/s, and 0.1 bar, respectively, resulting in distillate production of 0.001 kg/s.

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Section: Experiments Design Using Rsmmentioning

confidence: 99%

Design, Modelling and Optimization of a Novel Concentrated Solar Powered (CSP) Flash Desalination System Involving Direct Heating and Pressure Modulation Using Response Surface Methodology (RSM)

et al. 2022

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“…Both the main constituents in underfill fluid of epoxy resin and silica fillers were separately considered to establish a two-way fluid-solid interaction with the aim to visualize the epoxy flow and filler particle distribution during the underfill flow stage [5]. On the contrary, other numerical studies on filler distributions were either based on the cured underfill package [64] or at the completion of underfilling [65] In the recent years, particle-based LBM was used to simulate the underfill flow, which had seen various applications in conventional capillary underfill [12,17,45,46,48,66,67], mold underfill [68,69], and pressurized underfill [70]. While both LBM and FVM numerical findings are comparable in terms of flow visualization and filling time aspects, it is reported that LBM-based simulation can simulate the void formation during underfill flow for which FVM-based simulation is incapable to achieve [46].…”

Section: Numerical Simulationmentioning

confidence: 99%

Underfill Flow in Flip-Chip Encapsulation Process: A Review

Abas

2021

Journal of Electronic Packaging

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The scope of review of this paper focused on the pre-curing underfilling flow stage of encapsulation process. A total of 80 related works has been reviewed and being classified into process type, method employed, and objective attained. Statistically showed that the conventional capillary is the most studied underfill process, while the numerical simulation was mainly adopted. Generally, the analyses on the flow dynamic and distribution of underfill fluids in the bump array aimed for the filling time determination as well as the predictions of void occurrence. Parametric design optimization was subsequently conducted to resolve the productivity issue of long filling time and reliability issue of void occurrence. The bump pitch was found to the most investigated parameter, consistent to the miniaturization demand. To enrich the design versatility and flow visualization aspects, experimental test vehicle was innovated using imitated chip and replacement fluid, or even being scaled-up. Nonetheless, the analytical filling time models became more accurate and sophiscasted over the years, despite still being scarce in number. With the technological advancement on analysis tools and further development of analytic skills, it was believed that the future researches on underfill flow will become more comprehensive, thereby leading to the production of better packages in terms of manufacturing feasibility, performances, and reliability. Lastly, few potential future works were recommended, for instance, microscopic analysis on the bump-fluid interaction, consideration of filler particles and incorporation of artificial intelligence.

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High-Efficiency Multiobjective Synchronous Modeling and Solution of Analog ICs

Liu

Zhang

et al. 2022

Circuits Syst Signal Process

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Optimization of 3D IC stacking chip on molded encapsulation process: a response surface methodology approach

Cited by 7 publications

References 29 publications

Design, Modelling and Optimization of a Novel Concentrated Solar Powered (CSP) Flash Desalination System Involving Direct Heating and Pressure Modulation Using Response Surface Methodology (RSM)

Design, Modelling and Optimization of a Novel Concentrated Solar Powered (CSP) Flash Desalination System Involving Direct Heating and Pressure Modulation Using Response Surface Methodology (RSM)

Underfill Flow in Flip-Chip Encapsulation Process: A Review

High-Efficiency Multiobjective Synchronous Modeling and Solution of Analog ICs

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