Optimization of aging treatment in lead frame copper alloy by intelligent technique

Liu, Ping; Su, Juan; Dong, Qi; Li, He Jun

doi:10.1016/j.matlet.2005.05.069

Cited by 17 publications

(7 citation statements)

References 13 publications

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“…As related to the present experimental results, a number of studies were carried out for the precipitation of Cu-Ni-Si alloys [8][9][10][11]. However, small differences in the microstructures may hardly be found in alloys with a composition similar to the present alloys using methods such as observation by transmission electron microscopy.…”

Section: Effect Of Iron Addition and Two-step Aging On The Propertiessupporting

confidence: 52%

“…Very fine precipitates are formed in the copper matrix through these processes, due to which the copper base alloy is strengthened and its electrical conductivity is increased. Several studies on the mechanical properties and microstructure of copper-titanium binary alloys [1][2][3][4][5] and copper-nickel-silicon (Cu-Ni-Si) alloys [6][7][8][9][10][11] have been carried out thus far, and some interesting results on precipitation have been obtained. However, the systematic changes in the strength and electrical conductivity of copper base alloys by aging have not been adequately investigated yet since these properties appear to be influenced by the chemical composition and process conditions of the copper base alloys.…”

Section: Introductionmentioning

confidence: 99%

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Improvement in strength and electrical conductivity of Cu–Ni–Si alloys by aging and cold rolling

Suzuki¹,

Shibutani²,

Mimura³

et al. 2006

Journal of Alloys and Compounds

199

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Section: Effect Of Iron Addition and Two-step Aging On The Propertiessupporting

confidence: 52%

Section: Introductionmentioning

confidence: 99%

Improvement in strength and electrical conductivity of Cu–Ni–Si alloys by aging and cold rolling

Suzuki¹,

Shibutani²,

Mimura³

et al. 2006

Journal of Alloys and Compounds

199

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“…However, because of the toxicity of beryllium, novel metallic materials free of hazardous substances are needed as an alternative to copper-beryllium alloys. For that reason, various copperbase alloys, such as copper-titanium (Cu-Ti) binary alloys [1][2][3][4][5] and copper-nickel-silicon (Cu-Ni-Si) alloys, [6][7][8][9][10][11][12] have been developed. They show excellent properties as a result of controlling the processing conditions.…”

Section: Introductionmentioning

confidence: 99%

SAXS and XAFS Characterization of Precipitates in a High-Performance Cu–Ni–Si Alloy

Takahashi¹,

Sanada²,

Sato³

et al. 2007

Mater. Trans.

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Analyses of small-angle X-ray scattering (SAXS) and X-ray absorption fine structure (XAFS) were performed for characterizing precipitates formed in a Cu-3.1 at %Ni-1.4 at%Si alloy, the strength and electrical conductivity of which were improved by aging. SAXS profiles and XAFS spectra of samples aged at 720 K for different periods of time after a solution treatment were measured. SAXS profiles of samples, which were aged after the solution treatment and subsequently cold rolled, were also measured to investigate the effect of dislocations on precipitation. The results of SAXS measurements showed that nanometer-size precipitates formed in the alloy samples during isothermal aging at 720 K. The precipitates in the samples without cold rolling were coarsened in a single modal size distribution with increasing aging time. In contrast, the precipitates formed in the cold-rolled samples appeared to be coarsened in a multi-modal size distribution with increasing aging time. This aging characteristic of the cold-rolled samples is presumably attributable to their good electrical conductivity. The results of XAFS measurements at the Ni K-edge showed that nickel was substituted for copper in the face-centered cubic (fcc) copper matrix and that the local structure around nickel was changed by isothermal aging. With increasing aging time, extended X-ray absorption fine structure (EXAFS) functions at the Ni K-edge of the samples were found to be changed, which implies that nickel atoms were precipitated as nickel-silicon clusters or intermediate compounds in the fcc copper matrix. In addition, X-ray absorption near edge structure (XANES) spectra at the Ni K-edge indicated that the electronic structure of nickel in the samples was influenced by silicon during aging.

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“…With the rapid development of electronic information technology, products are developing towards micro, thin, multi-functional, and intelligent, which promotes the development of integrated circuits towards large-scale and super large-scale. It puts forward higher requirements not only on the strength and conductivity of the lead frame material but also on the processing performance of the material [1][2][3] .…”

Section: Introductionmentioning

confidence: 99%

Study on Cold Hardening and Recrystallization Temperature of Cu-Ni-Sn-P Alloy for Integrated Circuit Lead Frame

Yuan

Yang²,

Chen³

et al. 2023

J. Phys.: Conf. Ser.

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The work hardening curve of the Cu-Ni-Sn-P alloy for the integrated circuit lead frame was drawn by different degrees of cold deformation. The recrystallization temperature of the alloy was determined by testing the tensile strength, Vickers hardness, elongation, and electrical conductivity of the samples annealed at different temperatures and microstructure observation. The results show that the Cu-Ni-Sn-P alloy had obvious work hardening characteristics after being deformed by cold rolling; the tensile strength of the alloy showed a trend of first increasing and then tending to be stable with the increase of the working rate, while the elongation and electrical conductivity showed the opposite changing law. At the same annealing time, with the increase of annealing temperature, the tensile strength of Cu-Ni-Sn-P alloy decreased slowly first and then sharply, and finally tended to be stable. To effectively reduce energy consumption and shorten the production cycle, the reasonable recrystallization annealing system of Cu-Ni-Sn-P alloy after 60% deformation is determined to be 440°C×4h.

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Optimization of aging treatment in lead frame copper alloy by intelligent technique

Cited by 17 publications

References 13 publications

Improvement in strength and electrical conductivity of Cu–Ni–Si alloys by aging and cold rolling

Improvement in strength and electrical conductivity of Cu–Ni–Si alloys by aging and cold rolling

SAXS and XAFS Characterization of Precipitates in a High-Performance Cu–Ni–Si Alloy

Study on Cold Hardening and Recrystallization Temperature of Cu-Ni-Sn-P Alloy for Integrated Circuit Lead Frame

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Optimization of aging treatment in lead frame copper alloy by intelligent technique

Cited by 17 publications

References 13 publications

Improvement in strength and electrical conductivity of Cu–Ni–Si alloys by aging and cold rolling

Improvement in strength and electrical conductivity of Cu–Ni–Si alloys by aging and cold rolling

SAXS and XAFS Characterization of Precipitates in a High-Performance Cu&ndash;Ni&ndash;Si Alloy

Study on Cold Hardening and Recrystallization Temperature of Cu-Ni-Sn-P Alloy for Integrated Circuit Lead Frame

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SAXS and XAFS Characterization of Precipitates in a High-Performance Cu–Ni–Si Alloy