“…Recently, several studies have reported strategies to modify device designs, such as introducing wavy or origami structures to overcome the associated limitations of planar-type modules and highly integrated TE arrays. These modifications, however, often require additional post-structural deformation processes. ,, In this regard, the automated 3D printing process emerges as a powerful solution, enabling the customization of TE arrays with high resolution tailored to the shape and structure of the applications. , This customization can be achieved using rheology-modulated materials, which range widely from inorganic substances to polymers. − Most notably, the 3D printing process can facilely fabricate 3D-structured TE modules in an additive manner. This capability is crucial for developing temperature sensors capable of imposing temperature gradients in the out-of-plane direction when placed on target surfaces, thereby enhancing the detection of temperature changes.…”