Optimization of Cu electrodeposition parameters for Through Silicon Via (TSV)

Noh, Sang-Soo; Choi, Eun-Hey; Lee, Yong-Hyuk; Ju, Hyunjin; Rha, Sa‐Kyun; Lee, Boung-ju; Kim, Dong Kyu; Lee, Youn‐Seoung

doi:10.1109/ipfa.2011.5992776

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Fabrication and performances of a novel copper-ordered-reinforced polymer composite interposer

Wang¹,

Cheng²,

Li³

et al. 2014

J. Micromech. Microeng.

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A novel Cu-ordered-reinforced polymer composite interposer has been proposed in this paper. The structure of Cu reinforcement in the composite interposer has been designed and simulated by ANSYS software. Based on the simulation results, the ordered hexagonal Cu was chosen as the reinforcement in the polymer matrix. A circular composite interposer test chip with a diameter of 12.7 mm and a thickness of 0.16 mm was successfully fabricated utilizing the surface micromachining process. The mechanical, thermal and electrical properties of the fabricated copper-ordered-reinforced polymer composite interposer were characterized. The experimental results indicated that the thermal conductivity is 1.258 w m–1 k–1 and thermal expansion coefficient is 3.54 × 10−4 °C−1. Young's modulus is 6.2 GPa, and the breakdown voltage is larger than 100 V.

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