Optimization of electroless NiB deposition without stabilizer, based on surface roughness and plating rate

Bonin, Luiza; Castro, C. C.; Vitry, Véronique; Hantson, Anne-Lise; Delaunois, Fabienne

doi:10.1016/j.jallcom.2018.06.330

Cited by 36 publications

(41 citation statements)

References 22 publications

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“…Lead and thallium have primarily been used as standard stabilizers for 30 years in the industry of electroless nickel-boron deposit [15]. However, the emergence of new legislation dictates the limitation in using Pb [16] and Tl in the EN deposition baths [17].…”

Section: Introductionmentioning

confidence: 99%

“…Today, the lead content in the coating and the deposition bath used in industry is within the limits of the legislation [17,18]. On the other hand, as the legislation regarding environmental subjects is regularly strengthening, increased demand for completely removing lead and thallium from EN deposition baths has been seen in the metal deposition market.…”

Section: Introductionmentioning

confidence: 99%

“…On the other hand, as the legislation regarding environmental subjects is regularly strengthening, increased demand for completely removing lead and thallium from EN deposition baths has been seen in the metal deposition market. In addition, a few completely lead and thallium-free baths have been presented for electroless nickel-boron deposition [15,17,19,20]. One of them, developed by Bonin et al [17], completely removed the stabilizer agent from the bath and stabilized the bath by optimizing complexing agent concentration.…”

Section: Introductionmentioning

confidence: 99%

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Characterization of Electroless Nickel–Boron Deposit from Optimized Stabilizer-Free Bath

et al. 2021

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Conventional electroless nickel–boron deposits are produced using solutions that contain lead or thallium, which must be eliminated due to their toxicity. In this research, electroless nickel–boron deposits were produced in a stabilizer-free bath that does not include any toxic heavy metal. During processing, the plating rate increased from 10 to 14.5 µm/h by decreasing the concentration of the reducing agent, leading to increased bath stability. The thickness, composition, roughness, morphology, hardness, wear, and corrosion resistance of the deposits were characterized. The new deposit presents an excellent hardness of 933 ± 56 hv50, 866 ± 30 hk50, and 12 GPa from the instrumented indentation test (IIT), respectively, which are similar to that of hexavalent hard chromium coating. Moreover, by using both potentiodynamic polarization and salt spray tests it was shown that the coating presents higher corrosion resistance as compared to standard nickel-boron coatings. The new deposit exhibits properties close to those of the conventional electroless nickel–boron deposits. Therefore, it could replace them in any industrial applications.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Characterization of Electroless Nickel–Boron Deposit from Optimized Stabilizer-Free Bath

et al. 2021

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“…Note that the quality of reagents is important in electroless nickel formulations as these electrolytes are very sensitive to metallic impurities, usually present in low purity chemicals. Importantly, the ENP formulation used here meets the requirements of the RoHS and WEE standards [ 17 ]. Coatings were plated in 1L cylindrical glass cells for a total plating time of 1 h. Four NiP coatings were manufactured per condition during the optimization stage.…”

Section: Methodsmentioning

confidence: 99%

Full Optimization of an Electroless Nickel Solution: Boosting the Performance of Low-Phosphorous Coatings

et al. 2021

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Univariate and multivariate optimizations of a novel electroless nickel formulation have been carried out by means of the Taguchi method. From the compositional point of view, adjustment of the complexing agent concentration in solution is crucial for fine-tuning free Ni2+ ions concentration and, in turn, the mechanical properties of the resulting coatings. The Ni (II) concentration and the pH are the main parameters which help restrict the incorporation of phosphorous into the Ni layers. On the other hand, the stirring rate, the pH and the reducing agent concentration are the most influential parameters for the corrosion resistance of the coatings. Multivariate optimization of the electrolyte leads to a set of optimized parameters in which the mechanical properties (hardness and worn volume) of the layers are similar to the optimal values achieved in the univariate optimization, but the corrosion rate is decreased by one order of magnitude.

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“…A sufficiently strong reducing agent is required for autocatalytic metal deposition. The use of traditional reducing agents, such as borohydride, borane dimethylamine, and hypophosphite, results in the deposition of non-pure metal coatings that contained boron or phosphorous [14][15][16]. Moreover, when using hydrogen-containing reducing agents, the deposited coating structure has large defects due to the evolution of hydrogen gas.…”

Section: Introductionmentioning

confidence: 99%

Electroless Platinum Deposition Using Co3+/Co2+ Redox Couple as a Reducing Agent

Tamašauskaitė–Tamašiūnaitė

Dordi

Norkus

et al. 2021

Materials

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In the present work, the kinetics of electroless deposition of Pt, using a cobalt ion redox system (Co3+/Co2+) as a reducing agent, has been investigated. The deposition rate of Pt depends on the pH, concentration of reactants, and temperature. The deaeration and bubbling of the plating solution with argon play an essential role. It was found that 0.11 mg cm−2 of Pt films could be deposited on the surface of a roughed glass sheet in one hour without replenishing the solution. Additional data have been obtained on the grounds of electrochemical quartz crystal microbalance experiments. The bubbling (agitation) of the electroless Pt plating solution with argon during the deposition of Pt results in a higher deposition rate and is ca. 3 µg cm−2 min−1. The Pt deposition rate is far less, and is as low as 0.14 µg cm−2 min−1 when the electroless Pt plating solution is not bubbled with argon during the deposition of Pt.

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Optimization of electroless NiB deposition without stabilizer, based on surface roughness and plating rate

Cited by 36 publications

References 22 publications

Characterization of Electroless Nickel–Boron Deposit from Optimized Stabilizer-Free Bath

Characterization of Electroless Nickel–Boron Deposit from Optimized Stabilizer-Free Bath

Full Optimization of an Electroless Nickel Solution: Boosting the Performance of Low-Phosphorous Coatings

Electroless Platinum Deposition Using Co3+/Co2+ Redox Couple as a Reducing Agent

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