2012
DOI: 10.1016/j.apsusc.2011.09.108
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Optimization of laser-firing processes for silicon-heterojunction solar-cell back contacts

Abstract: Keywords:Laser firing Laser processing Heterojunction Solar cell Surface treatment One of the key steps to achieve high efficiencies in amorphous/crystalline silicon photovoltaic structures is to design low-ohmic-resistance back contacts with good passivation in the rear part of the cell. A well known approach to achieve this goal is to use laser-flred contact (LFC) processes in which a metal layer is fired through the dielectric to define good contacts with the semiconductor. However, and despite the fact tha… Show more

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Cited by 21 publications
(9 citation statements)
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“…r processing ha ontacts, has b s than the typ minum fired co ed ohmic conta sufficiently hig urface field fo vation [11]. If e film to form ed contacts, an chnique, referre imes and low on to improve t that provides ty contacts hav ers [14]. CIGS devices utilize a substrate device structure, typically with a glass substrate.…”
Section: Lamentioning
confidence: 99%
“…r processing ha ontacts, has b s than the typ minum fired co ed ohmic conta sufficiently hig urface field fo vation [11]. If e film to form ed contacts, an chnique, referre imes and low on to improve t that provides ty contacts hav ers [14]. CIGS devices utilize a substrate device structure, typically with a glass substrate.…”
Section: Lamentioning
confidence: 99%
“…But photolithography is expensive and is not a friendly process for large volume industrial production. The alternative method is to use laserfired contacts (LFC) of aluminium (Al) through the rear passivation layer [1][2][3][4][5].…”
Section: Introductionmentioning
confidence: 99%
“…Many papers have reported the effects of damage zones during the LFC process . Most of the research efforts have been made to find the LFC process conditions at a reduced laser power in order to suppress the laser‐induced damage . In case of the conventional LFC method, if the laser power is lowered, then the size of the contact holes becomes decreased, resulting in increased series resistances.…”
Section: Introductionmentioning
confidence: 99%