We present a new analytical model for switching characteristics of Si d-MESFETs using Pearson distribution (FMA) under thermal annealing. The analysis is carried out with phosphorus, arsenic and antimony implants. The e ects of pro® le shape on the switching characteristics are analysed. A detail investigation of drain± source resistance and time constants is reported. The dependence of implant dose and energy has also been studied. The analysis is further extended to demonstrate the ® gure of merit of a FET device which leads to the optimization of device performance in high frequencies.Nomenclature C gd gate± drain capacitance C gs gate± source capacitance D di usion co-e cient of impurity ions f T cut-o frequency g m transconductance L channel length N a substrate doping concentration Q implant dose R ds drain± source resistance R p implant range parameter t annealing time t gd time constant t gs time constant t T total time constant V ( y) channel potential V bi built-in voltage V BS substrate to source voltage V DS drain to source voltage V GS gate to source voltage V 1 voltage parameter V 2 voltage parameter x direction along which ions are implanted X dg distance from surface to edge of gate depletion region in the channel X ds distance from surface to edge of substrate depth region in the channel X P distance from surface to channel potential minimum X PM maximum value of X P in the above threshold condition with V P = 0 Z channel width