2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) 2020
DOI: 10.1109/estc48849.2020.9229817
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Optimization of soldering experiments for power devices interconnection and packaging

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“…Experimental results regarding the characterizations of deposited Cu and SnAg alloy (in particular topology and surface roughness) are detailed in [26].…”
Section: Materials and Experimental Methodsmentioning
confidence: 99%
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“…Experimental results regarding the characterizations of deposited Cu and SnAg alloy (in particular topology and surface roughness) are detailed in [26].…”
Section: Materials and Experimental Methodsmentioning
confidence: 99%
“…Moreover, earlier studies showed that adding a preliminary reflow process (noted here by pre-reflow), before performing the soldering process (assembly), enhances the assembly results, in terms of porosities portion and their repeatability. It is important to point out that, thanks to the pre-reflow process, not only the solder surface tends to form convex shape, but it also provides a significant decrease of the surface roughness of SnAg solder (from 300 to 40 nm [26]). In this study, the pre-reflow process consists of a standard thermal profile with an isothermal holding at 250 °C for 50 s.…”
Section: Materials and Experimental Methodsmentioning
confidence: 99%